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SAF3560HV/V1102

NXP Semiconductors

SAF3560HV/V1102 by NXP Semiconductors

SAF3560HV/V1102 by NXP Semiconductors is a consumer IC with 144 terminals in a square package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. Features include low profile, fine pitch design for compact applications like consumer circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,162 parts In-Stock

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Anansix

USA . 1,143 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,075 parts In-Stock

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Vyrian

USA . 349 parts In-Stock

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349

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Nova Conductors

Japan . 94 parts In-Stock

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94

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 140 parts In-Stock

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$3.770

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140

$3.770

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AZTECH Wire

Italy . 478 parts In-Stock

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$5.044

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478

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One Stop Electronics

USA . 584 parts In-Stock

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$8.800

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$8.800

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Ampacity Inc.

Singapore . 1,562 parts In-Stock

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$11.800

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$11.800

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Semicontronic

India . 757 parts In-Stock

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$11.800

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$11.505

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$11.446

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757

$11.800

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$11.446

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Lixinc

USA . 18,950 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,249 parts In-Stock

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UNI Independent Distributors

Spain . 6,159 parts In-Stock

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Corphita

USA . 3,749 parts In-Stock

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Argo Parts USA

USA . 3,649 parts In-Stock

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Continental Prestige Electronics

USA . 3,457 parts In-Stock

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Bastille Electronics

Australia . 2,868 parts In-Stock

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Assy Fe

Spain . 1,800 parts In-Stock

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1,800

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Corohmni

South Africa . 439 parts In-Stock

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439

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Overview

Elevate your consumer electronics to the next level with the SAF3560HV/V1102 from NXP Semiconductors. Known for their high-quality products, NXP Semiconductors delivers cutting-edge solutions in the consumer IC category. This versatile and reliable IC offers a wide range of applications, providing value and benefits to customers looking to enhance their devices. Experience top-notch performance and efficiency with the SAF3560HV/V1102, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for consumer applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB layout.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IC can be used in cold environments without issues.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection to the PCB.

Width: 20 mm

Compact width of 20mm enables the IC to fit into small spaces and tight layouts.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage requirement makes the IC energy efficient and suitable for low power applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the IC can withstand harsh operating conditions in industrial settings.

Terminal Form: GULL WING

Gull wing terminal form provides easy assembly and soldering onto the PCB.

Technical Specifications

Other Function Consumer ICs SAF3560HV/V1102 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

1.32 V

Minimum Supply Voltage (Vsup):

1.14 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

SAF3560HV/V1102 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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