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TDA18273HN/C1,551

NXP Semiconductors

TDA18273HN/C1,551 by NXP Semiconductors

TDA18273HN/C1,551 by NXP Semiconductors is a 40-terminal IC with a power supply of 3.3V. It comes in a square chip carrier package and is surface mountable. This IC is commonly used in consumer electronics for various functions due to its compact size and high performance capabilities.

Median Price

$1.400

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 222 parts In-Stock

1+ parts

-

100+ parts

$1.400

1k+ parts

$1.160

10k+ parts

$1.040

222

-

$1.400

$1.160

$1.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 973 parts In-Stock

1+ parts

$1.092

100+ parts

-

1k+ parts

-

10k+ parts

-

973

$1.092

-

-

-

Vyrian

USA . 5,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,239

-

-

-

-

Anansix

USA . 1,428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,428

-

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 401 parts In-Stock

1+ parts

$0.240

100+ parts

-

1k+ parts

-

10k+ parts

-

401

$0.240

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.447

100+ parts

$0.425

1k+ parts

$0.425

10k+ parts

-

100

$0.447

$0.425

$0.425

-

Ampacity Inc.

Singapore . 242 parts In-Stock

1+ parts

$0.980

100+ parts

-

1k+ parts

-

10k+ parts

-

242

$0.980

-

-

-

Semicontronic

India . 222 parts In-Stock

1+ parts

$0.980

100+ parts

$0.956

1k+ parts

$0.951

10k+ parts

-

222

$0.980

$0.956

$0.951

-

Corphita

USA . 3,949 parts In-Stock

1+ parts

$1.035

100+ parts

-

1k+ parts

-

10k+ parts

-

3,949

$1.035

-

-

-

Microchip USA

USA . 375 parts In-Stock

1+ parts

$1.874

100+ parts

-

1k+ parts

-

10k+ parts

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375

$1.874

-

-

-

AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$17.613

100+ parts

-

1k+ parts

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10k+ parts

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283

$17.613

-

-

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Argo Parts USA

USA . 2,949 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,949

-

-

-

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Continental Prestige Electronics

USA . 1,419 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,419

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-

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UNI Independent Distributors

Spain . 1,211 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,211

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-

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Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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200

-

-

-

-

Overview

Unlock a world of possibilities with the TDA18273HN/C1,551 by NXP Semiconductors. Known for their superior quality and reliability, NXP Semiconductors delivers cutting-edge technology in the category of Other Function Consumer ICs. This innovative product offers customers unparalleled value, benefits, and advantages in various applications. From enhanced performance to increased efficiency, the TDA18273HN/C1,551 is the perfect solution for your electronic needs. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer electronics applications.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, making the product suitable for automated assembly processes.

Package Shape: SQUARE

The square shape of the package helps in efficient use of space on the circuit board, enabling compact designs.

Power Supplies (V): 3.3

The 3.3V power supply voltage is common in many consumer electronic devices, ensuring compatibility with existing systems.

No. of Terminals: 40

The high number of terminals allows for connectivity to multiple components, increasing the versatility of the product.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers thermal and mechanical protection to the IC, enhancing its reliability and lifespan.

Terminal Position: QUAD

The quad terminal position simplifies soldering and connection processes, reducing the chances of errors during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures robust solder joints, improving the overall durability of the product.

Terminal Form: NO LEAD

The absence of leads provides better electrical performance and thermal characteristics, contributing to the product's efficiency.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting, making the product suitable for compact designs with limited space.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates that the product has moderate sensitivity to moisture, ensuring reliable performance in various environmental conditions.

Technical Specifications

Other Function Consumer ICs TDA18273HN/C1,551 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18273HN/C1,551 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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