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TDA10025HN/C1,557

NXP Semiconductors

TDA10025HN/C1,557 by NXP Semiconductors

TDA10025HN/C1,557 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates on power supplies of 1.2V and 3.3V, features a compact 48-terminal quad package, and withstands peak reflow temps up to 260 °C. Ideal for multimedia processing in consumer electronics.

Median Price

$2.175

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,300 parts In-Stock

1+ parts

-

100+ parts

$1.950

1k+ parts

$1.740

10k+ parts

$1.640

14,300

-

$1.950

$1.740

$1.640

DigiKey

USA . 14,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.250

10k+ parts

$2.250

14,300

-

-

$2.250

$2.250

Verical

USA . 14,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.175

10k+ parts

$2.050

14,300

-

-

$2.175

$2.050

Flip Electronics (Authorized)

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,578 parts In-Stock

1+ parts

$2.052

100+ parts

-

1k+ parts

-

10k+ parts

-

4,578

$2.052

-

-

-

Vyrian

USA . 2,152 parts In-Stock

1+ parts

$2.160

100+ parts

-

1k+ parts

-

10k+ parts

-

2,152

$2.160

-

-

-

Flip Electronics

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,500

-

-

-

-

Anansix

USA . 2,551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,551

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 204 parts In-Stock

1+ parts

$1.944

100+ parts

-

1k+ parts

-

10k+ parts

-

204

$1.944

-

-

-

Microchip USA

USA . 250 parts In-Stock

1+ parts

$3.114

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$3.114

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,351

-

-

-

-

UNI Independent Distributors

Spain . 5,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,861

-

-

-

-

Overview

Elevate your consumer electronics with the TDA10025HN/C1,557 from NXP Semiconductors—a leader in innovative solutions. This high-quality IC enhances audio and video applications, ensuring seamless integration and performance. With its compact design and robust reliability, you can enjoy reduced footprint without compromising on efficiency. Trust NXP to deliver exceptional value and superior technology, empowering your projects for success in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Being surface mount compatible allows for a more compact design and easier integration into modern electronic circuits, improving design flexibility.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCB layouts, making it easier to arrange multiple components.

Power Supplies (V): 1.2, 3.3

Supporting multiple power supply voltages (1.2V and 3.3V) makes this IC versatile and compatible with a wide range of applications.

No. of Terminals: 48

With 48 terminals, this product is capable of supporting complex functionalities and high integration, suitable for advanced electronic applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers excellent thermal performance and is ideal for high-density applications, ensuring efficient heat dissipation.

Terminal Position: QUAD

The quad terminal position enables better connectivity and layout options on printed circuit boards, facilitating easier designs.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with industry-standard soldering processes, ensuring reliability during manufacturing.

Terminal Form: NO LEAD

The no-lead design minimizes the footprint and enhances the electrical performance due to shorter lead lengths, ideal for space-constrained applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for denser terminal arrangements, making it suitable for miniaturized electronic devices without compromising performance.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this IC is suitable for standard handling procedures, offering a good balance between moisture resistance and ease of use during assembly.

Technical Specifications

Other Function Consumer ICs TDA10025HN/C1,557 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA10025HN/C1,557 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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