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TDA18212HN/M/C1,51

NXP Semiconductors

TDA18212HN/M/C1,51 by NXP Semiconductors

TDA18212HN/M/C1,51 by NXP Semiconductors is a 40-terminal IC with a power supply of 3.3V and peak reflow temperature of 260°C. It comes in a square-shaped chip carrier package suitable for surface mount applications. This IC is ideal for various consumer electronic functions requiring high performance and reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,996 parts In-Stock

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3,996

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Vyrian

USA . 733 parts In-Stock

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733

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Anansix

USA . 245 parts In-Stock

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245

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,184 parts In-Stock

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$0.762

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4,184

$0.762

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Corohmni

South Africa . 181 parts In-Stock

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$1.312

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$1.312

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Microchip USA

USA . 453 parts In-Stock

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$1.868

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453

$1.868

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Ampacity Inc.

Singapore . 922 parts In-Stock

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$10.800

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922

$10.800

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AZTECH Wire

Italy . 733 parts In-Stock

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$16.854

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733

$16.854

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One Stop Electronics

USA . 722 parts In-Stock

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$19.800

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722

$19.800

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Corphita

USA . 3,787 parts In-Stock

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3,787

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Argo Parts USA

USA . 2,529 parts In-Stock

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2,529

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UNI Independent Distributors

Spain . 1,011 parts In-Stock

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Continental Prestige Electronics

USA . 127 parts In-Stock

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127

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Upgrade your consumer electronics with the TDA18212HN/M/C1,51 by NXP Semiconductors. This high-quality chip carrier offers reliability and efficiency, making it perfect for a variety of applications. With its advanced features and sturdy construction, this product ensures top-notch performance. Experience the benefits of seamless integration and optimal power supplies, all in a compact and versatile package. Trust NXP Semiconductors to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the integrated circuit, ensuring long-term reliability.

Surface Mount: YES

Being surface-mountable makes this product easy to install on printed circuit boards, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, making it suitable for applications where space is limited.

Power Supplies (V): 3.3

Operating at 3.3 volts makes this product compatible with a wide range of electronic systems and devices using this common voltage level.

No. of Terminals: 40

Having 40 terminals provides flexibility for interfacing with other components and devices, allowing for versatile application usage.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and easy installation, ideal for high-power applications and demanding environments.

Terminal Position: QUAD

The quad terminal position provides stability and secure connectivity, ensuring reliable operation under various conditions.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand the soldering process during assembly without compromising its performance.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with RoHS standards, making it a sustainable choice for electronic designs.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting and precise connections, suitable for compact electronic devices and miniaturized designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can withstand moderate exposure to moisture during storage and handling, ensuring reliability in various environments.

Technical Specifications

Other Function Consumer ICs TDA18212HN/M/C1,51 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18212HN/M/C1,51 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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