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TDA10025HN/C1/S3Y

NXP Semiconductors

TDA10025HN/C1/S3Y by NXP Semiconductors

TDA10025HN/C1/S3Y by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates on power supplies of 1.2V and 3.3V, features a compact 48-terminal quad no-lead package, and is ideal for advanced electronic systems. Its plastic/epoxy construction ensures durability in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 6,500 parts In-Stock

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6,500

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 6,500 parts In-Stock

1+ parts

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6,500

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Vyrian

USA . 4,910 parts In-Stock

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4,910

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Digiode

USA . 2,946 parts In-Stock

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2,946

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Anansix

USA . 1,099 parts In-Stock

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1,099

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UNI Independent Distributors

Spain . 5,893 parts In-Stock

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5,893

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Corphita

USA . 2,515 parts In-Stock

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2,515

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Overview

Unlock the potential of your designs with the TDA10025HN/C1/S3Y from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP empowers you with a versatile IC that enhances consumer applications across various domains. Experience seamless integration, superior performance, and reliability, making it ideal for next-gen electronics. Elevate your projects with a trusted partner dedicated to delivering exceptional value and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures that the product is lightweight and resistant to environmental stress, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier and automated assembly, contributing to lower production costs and improved efficiency in manufacturing.

Package Shape: SQUARE

The square package shape provides a compact footprint, which is beneficial for space-constrained designs and helps facilitate better thermal management.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages (1.2V and 3.3V) enhances versatility and compatibility with a broader range of digital systems.

No. of Terminals: 48

With 48 terminals, this IC offers extensive functionality and connectivity options, making it adaptable for complex circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier design promotes good thermal performance and enhances interconnection reliability, making it suitable for high-speed applications.

Terminal Position: QUAD

Quad terminal positioning allows for effective routing in circuit boards, facilitating easier and more efficient layout designs.

Terminal Form: NO LEAD

No lead terminal form helps reduce the risk of solder joint failure and improves overall reliability in high-density scenarios.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch increases packing density, allowing for smaller designs without compromising performance or functionality.

Technical Specifications

Other Function Consumer ICs TDA10025HN/C1/S3Y attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA10025HN/C1/S3Y General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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