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TDA18212HN/S/C1,55

NXP Semiconductors

TDA18212HN/S/C1,55 by NXP Semiconductors

TDA18212HN/S/C1,55 by NXP Semiconductors is a 40-terminal IC with a power supply of 3.3V. It features a square package shape, chip carrier style, and quad terminal position. Ideal for consumer electronics applications requiring surface mount technology and high-temperature reflow processes.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 917 parts In-Stock

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917

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Vyrian

USA . 547 parts In-Stock

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547

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Anansix

USA . 267 parts In-Stock

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267

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 323 parts In-Stock

1+ parts

$2.808

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323

$2.808

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One Stop Electronics

USA . 610 parts In-Stock

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$4.800

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610

$4.800

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AZTECH Wire

Italy . 547 parts In-Stock

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$10.541

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547

$10.541

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Ampacity Inc.

Singapore . 942 parts In-Stock

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$21.800

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942

$21.800

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Microchip USA

USA . 533 parts In-Stock

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$42.457

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533

$42.457

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Corohmni

South Africa . 345 parts In-Stock

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$57.798

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345

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UNI Independent Distributors

Spain . 5,856 parts In-Stock

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Continental Prestige Electronics

USA . 5,245 parts In-Stock

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Argo Parts USA

USA . 3,282 parts In-Stock

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Corphita

USA . 3,049 parts In-Stock

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3,049

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Overview

Unlock a world of endless possibilities with the TDA18212HN/S/C1,55 by NXP Semiconductors. Known for their top-notch quality and reliability, NXP Semiconductors brings you a cutting-edge solution in the category of Other Function Consumer ICs. This versatile chip carrier package offers 40 terminals and a peak reflow temperature of 260°C, ensuring seamless integration into your projects. Whether you're designing consumer electronics or industrial applications, this surface-mount device delivers unmatched performance and efficiency at a value that can't be beat. Elevate your designs with the TDA18212HN/S/C1,55 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good thermal and mechanical properties, making the product durable and reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making the product suitable for automated manufacturing processes.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the PCB and enabling high-density mounting of components.

Power Supplies (V): 3.3

Operating at 3.3V power supply ensures compatibility with modern electronic systems and reduces power consumption for energy efficiency.

No. of Terminals: 40

Having 40 terminals allows for a greater number of connections and functionalities, making the product versatile and capable of handling complex tasks.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers excellent thermal performance and electrical characteristics, ensuring reliable operation under various operating conditions.

Terminal Position: QUAD

Quad terminal position provides better mechanical stability and improved signal integrity, minimizing signal interference and enhancing overall performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high-temperature soldering processes, ensuring proper solder connections and reliable operation.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, making the product safer for users and the environment.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5mm allows for tighter component spacing and more compact PCB designs, ideal for miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the product is suitable for standard industrial handling and storage conditions, ensuring long-term reliability and performance.

Technical Specifications

Other Function Consumer ICs TDA18212HN/S/C1,55 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18212HN/S/C1,55 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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