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LM8342SDX/NOPB

Texas Instruments

LM8342SDX/NOPB by Texas Instruments

LM8342SDX/NOPB by Texas Instruments is a small outline, very thin profile consumer IC with 10 terminals. It operates in industrial temperature range from -40 to 85°C and supports supply voltage from 2.25V to 3.6V. This IC is suitable for various consumer circuit applications requiring a compact design and surface mount capability.

Median Price

$1.001

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 80,577 parts In-Stock

1+ parts

$1.001

100+ parts

$0.827

1k+ parts

$0.447

10k+ parts

-

80,577

$1.001

$0.827

$0.447

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.447

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$0.447

-

-

-

Digiode

USA . 1,775 parts In-Stock

1+ parts

$0.951

100+ parts

-

1k+ parts

-

10k+ parts

-

1,775

$0.951

-

-

-

Vyrian

USA . 80,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80,287

-

-

-

-

Anansix

USA . 864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

864

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,761 parts In-Stock

1+ parts

$0.447

100+ parts

-

1k+ parts

-

10k+ parts

$0.434

4,761

$0.447

-

-

$0.434

Continental Prestige Electronics

USA . 3,492 parts In-Stock

1+ parts

$0.447

100+ parts

-

1k+ parts

-

10k+ parts

$0.438

3,492

$0.447

-

-

$0.438

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.447

100+ parts

-

1k+ parts

$0.425

10k+ parts

$0.416

1,000

$0.447

-

$0.425

$0.416

Corphita

USA . 642 parts In-Stock

1+ parts

$0.901

100+ parts

-

1k+ parts

-

10k+ parts

-

642

$0.901

-

-

-

Ampacity Inc.

Singapore . 80,232 parts In-Stock

1+ parts

$1.850

100+ parts

-

1k+ parts

-

10k+ parts

-

80,232

$1.850

-

-

-

Parana Technologies

USA . 2,289 parts In-Stock

1+ parts

$2.731

100+ parts

-

1k+ parts

$3.213

10k+ parts

-

2,289

$2.731

-

$3.213

-

DigiPath Technology Company

USA . 730 parts In-Stock

1+ parts

$3.007

100+ parts

$2.766

1k+ parts

-

10k+ parts

-

730

$3.007

$2.766

-

-

ChromeModa Solutions

Germany . 1,168 parts In-Stock

1+ parts

$3.068

100+ parts

$2.516

1k+ parts

-

10k+ parts

-

1,168

$3.068

$2.516

-

-

IDEA Electronic Components Group

UK . 222 parts In-Stock

1+ parts

$3.068

100+ parts

-

1k+ parts

$2.761

10k+ parts

-

222

$3.068

-

$2.761

-

Microchip USA

USA . 6,610 parts In-Stock

1+ parts

$4.190

100+ parts

-

1k+ parts

-

10k+ parts

-

6,610

$4.190

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,825

-

-

-

-

Lixinc

USA . 8,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,653

-

-

-

-

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

A-Z Elektronik GmbH

Germany . 231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

231

-

-

-

-

Overview

Upgrade your consumer electronics with the LM8342SDX/NOPB by Texas Instruments. This high-quality IC offers reliable performance and precise functionality, thanks to its manufacturer's reputation for excellence. Ideal for a wide range of applications, this small outline, very thin profile package delivers exceptional value, benefits, and advantages to customers seeking top-notch circuitry solutions. Trust Texas Instruments to enhance your products with cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and reliability for the product.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Package Shape: SQUARE

Square shape can help in better utilization of PCB space.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, ensuring optimal performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Provides a wide operating temperature range for versatility in different environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability.

Terminal Position: DUAL

Dual terminal position allows for versatility in design and flexibility in connectivity.

Width: 3 mm

Compact width for space-efficient PCB layout.

Minimum Supply Voltage (Vsup): 2.25 V

Low minimum supply voltage for energy efficiency.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly process.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial applications with varying temperature conditions.

Terminal Form: NO LEAD

Lead-free terminal form for environmental sustainability.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage for flexibility in power requirements.

Technical Specifications

Other Function Consumer ICs LM8342SDX/NOPB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

LM8342SDX/NOPB General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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