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LM8300IMT9

Texas Instruments

LM8300IMT9 by Texas Instruments

LM8300IMT9 by Texas Instruments is a consumer IC with 48 terminals in a small outline package. It operates b/w 0-70°C, with supply voltage ranging from 2.7V to 5.5V. Ideal for applications requiring compact design and high performance in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,995 parts In-Stock

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8,995

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Anansix

USA . 2,218 parts In-Stock

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2,218

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Digiode

USA . 732 parts In-Stock

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732

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,553 parts In-Stock

1+ parts

$0.475

100+ parts

-

1k+ parts

$1.616

10k+ parts

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1,553

$0.475

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$1.616

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DigiPath Technology Company

USA . 316 parts In-Stock

1+ parts

$0.523

100+ parts

$0.481

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316

$0.523

$0.481

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ChromeModa Solutions

Germany . 3,171 parts In-Stock

1+ parts

$0.534

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$0.438

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3,171

$0.534

$0.438

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IDEA Electronic Components Group

UK . 675 parts In-Stock

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$0.534

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$0.481

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675

$0.534

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$0.481

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AZTECH Wire

Italy . 647 parts In-Stock

1+ parts

$6.456

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647

$6.456

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One Stop Electronics

USA . 368 parts In-Stock

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$16.800

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368

$16.800

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Component Stockers USA

USA . 429 parts In-Stock

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$99.990

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429

$99.990

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Corphita

USA . 4,838 parts In-Stock

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4,838

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Alle Elektronik GmbH

Germany . 4,787 parts In-Stock

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4,787

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kepictronics

USA . 2,698 parts In-Stock

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2,698

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Microchip USA

USA . 447 parts In-Stock

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447

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Overview

Experience unmatched quality and reliability with the LM8300IMT9 by Texas Instruments, a leading manufacturer in the industry. This versatile consumer circuit IC offers a wide range of applications and features a small outline, thin profile package for easy integration. With a temperature grade of commercial and a wide operating voltage range, this product ensures optimal performance in various environments. Trust Texas Instruments to deliver cutting-edge technology that brings value, benefits, and advantages to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the IC, making it suitable for consumer applications where reliability is important.

Surface Mount: YES

Surface mount capability allows for easy mounting and soldering onto a circuit board, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient usage of board space and allows for neat arrangement of components in a compact design.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and performance in common electronic devices.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options for interfacing with other components and external devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows the IC to withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable operation even in cold environments, increasing the product's versatility.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves connection stability, reducing the risk of signal loss or malfunction.

Maximum Seated Height: 1.1 mm

Low seated height minimizes the overall profile of the IC, ideal for space-constrained applications and compact electronic devices.

Width: 6.1 mm

Narrow width allows for easy integration in tight spaces and enables a sleek and slim design for the end product.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement makes the IC energy-efficient and suitable for battery-powered devices with limited power resources.

Length: 12.5 mm

Compact length contributes to the overall small footprint of the IC, optimizing board space utilization and facilitating miniaturization of electronic products.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates the IC is suitable for standard operating conditions in everyday consumer electronics, ensuring reliable performance.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering connections and enhances mechanical strength, preventing detachment or disconnection of terminals.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB, enabling a compact design layout and efficient use of board space.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage capability supports a wide range of input power sources, offering flexibility in the selection of operating voltages.

Technical Specifications

Other Function Consumer ICs LM8300IMT9 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G48

Length:

12.5 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

LM8300IMT9 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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