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LM8325-1GRA25A

Texas Instruments

LM8325-1GRA25A by Texas Instruments

Texas Instruments LM8325-1GRA25A is a consumer IC with 25 terminals in a grid array package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. With a thin profile and fine pitch, it supports supply voltage from 1.62V to 1.98V for various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,965 parts In-Stock

1+ parts

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100+ parts

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7,965

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Digiode

USA . 4,655 parts In-Stock

1+ parts

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4,655

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,685 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

$1.521

10k+ parts

-

1,685

$0.220

-

$1.521

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DigiPath Technology Company

USA . 2,040 parts In-Stock

1+ parts

$0.242

100+ parts

$0.223

1k+ parts

-

10k+ parts

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2,040

$0.242

$0.223

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ChromeModa Solutions

Germany . 3,180 parts In-Stock

1+ parts

$0.247

100+ parts

$0.203

1k+ parts

-

10k+ parts

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3,180

$0.247

$0.203

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IDEA Electronic Components Group

UK . 158 parts In-Stock

1+ parts

$0.247

100+ parts

-

1k+ parts

$0.222

10k+ parts

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158

$0.247

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$0.222

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One Stop Electronics

USA . 1,445 parts In-Stock

1+ parts

$13.800

100+ parts

-

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10k+ parts

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1,445

$13.800

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AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$16.264

100+ parts

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784

$16.264

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Corphita

USA . 1,669 parts In-Stock

1+ parts

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1,669

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Overview

Experience superior quality and reliability with the LM8325-1GRA25A by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers cutting-edge technology for consumer ICs like this one. This versatile product is perfect for a wide range of applications, ensuring optimal performance and efficiency. With its advanced features and durable construction, the LM8325-1GRA25A provides exceptional value and benefits to customers looking for top-notch electronic components. Choose Texas Instruments for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides stability and durability to the product, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape helps in easy placement and alignment on circuit boards, optimizing space utilization.

No. of Terminals: 25

Having 25 terminals allows for multiple connections and versatility in circuit design, providing flexibility in functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in diverse operating conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the product to function effectively even in extreme cold environments, expanding its usability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy installation and connection, enhancing convenience during circuit integration.

Minimum Supply Voltage (Vsup): 1.62 V

Low minimum supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robustness and reliability in harsh industrial settings, making it a dependable choice for demanding applications.

Technical Specifications

Other Function Consumer ICs LM8325-1GRA25A attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B25

Length:

3 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

1.98 V

Minimum Supply Voltage (Vsup):

1.62 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

3 mm

Trade Compliance

LM8325-1GRA25A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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