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LM1973M/NOPB

Texas Instruments

LM1973M/NOPB by Texas Instruments

LM1973M/NOPB by Texas Instruments is a CMOS IC with +-6V power supplies, 20 terminals, and 5mA max supply current. It is used in consumer circuits for various applications due to its small outline package style and dual terminal position.

Median Price

$3.522

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,958 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

10,958

-

$3.130

$2.800

$2.630

Verical

USA . 6,302 parts In-Stock

1+ parts

-

100+ parts

$3.913

1k+ parts

$3.500

10k+ parts

$3.288

6,302

-

$3.913

$3.500

$3.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 124 parts In-Stock

1+ parts

$3.100

100+ parts

-

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124

$3.100

-

-

-

Digiode

USA . 1,641 parts In-Stock

1+ parts

$3.306

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-

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1,641

$3.306

-

-

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Vyrian

USA . 2,906 parts In-Stock

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2,906

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Anansix

USA . 2,703 parts In-Stock

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2,703

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ComSIT Distribution GmbH

Germany . 67 parts In-Stock

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67

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EMSNET

USA . 7 parts In-Stock

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7

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Distributors (Availability)

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Ampacity Inc.

Singapore . 17,343 parts In-Stock

1+ parts

$2.960

100+ parts

-

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-

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-

17,343

$2.960

-

-

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Aranea Global

USA . 550 parts In-Stock

1+ parts

$3.038

100+ parts

-

1k+ parts

$2.916

10k+ parts

-

550

$3.038

-

$2.916

-

Continental Prestige Electronics

USA . 10,299 parts In-Stock

1+ parts

$3.100

100+ parts

-

1k+ parts

-

10k+ parts

$3.038

10,299

$3.100

-

-

$3.038

Argo Parts USA

USA . 5,727 parts In-Stock

1+ parts

$3.100

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5,727

$3.100

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Corphita

USA . 3,362 parts In-Stock

1+ parts

$3.132

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3,362

$3.132

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-

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Parana Technologies

USA . 1,116 parts In-Stock

1+ parts

$3.382

100+ parts

-

1k+ parts

$3.909

10k+ parts

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1,116

$3.382

-

$3.909

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DigiPath Technology Company

USA . 828 parts In-Stock

1+ parts

$3.724

100+ parts

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828

$3.724

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ChromeModa Solutions

Germany . 5,036 parts In-Stock

1+ parts

$3.800

100+ parts

$3.116

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5,036

$3.800

$3.116

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IDEA Electronic Components Group

UK . 1,383 parts In-Stock

1+ parts

$3.800

100+ parts

-

1k+ parts

$3.420

10k+ parts

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1,383

$3.800

-

$3.420

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AZTECH Wire

Italy . 332 parts In-Stock

1+ parts

$21.320

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332

$21.320

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Microchip USA

USA . 2,797 parts In-Stock

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2,797

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A-Z Elektronik GmbH

Germany . 2,258 parts In-Stock

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2,258

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Alle Elektronik GmbH

Germany . 1,505 parts In-Stock

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1,505

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Perfect Parts

USA . 691 parts In-Stock

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691

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Overview

Unlock the potential of your consumer electronic designs with the LM1973M/NOPB by Texas Instruments. Crafted with precision and expertise, this small outline IC offers reliable performance and versatility for a wide range of applications. From audio amplifiers to power management systems, this consumer circuit delivers exceptional quality and efficiency, ensuring optimal functionality in every use case. Trust Texas Instruments to provide innovative solutions that elevate your products to the next level. Elevate your designs with the LM1973M/NOPB.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount:

YES - Being surface mountable allows for easy installation and space-saving on PCBs.

Package Shape:

RECTANGULAR - The rectangular package shape ensures compatibility with standard PCB layouts.

General IC Type:

CONSUMER CIRCUIT - Designed for consumer applications, making it suitable for a wide range of electronic devices.

Power Supplies (V):

+-6 - Supports a range of power supplies, offering flexibility in design and compatibility.

No. of Terminals:

20 - Sufficient number of terminals for connectivity and functionality within the circuit.

Package Style (Meter):

SMALL OUTLINE - The small outline package style conserves space on the PCB for efficient design.

Maximum Operating Temperature:

70 °C - Can operate at a wide temperature range for versatility in various environments.

Minimum Operating Temperature:

0 °C - Capable of functioning in low-temperature conditions without performance issues.

Terminal Finish:

MATTE TIN - The matte tin terminal finish provides good solderability and corrosion resistance.

Terminal Position:

DUAL - Dual terminal position for increased connectivity and stability within the circuit.

Maximum Seated Height:

2.65 mm - Low profile design for compact electronic devices and space-constrained applications.

Width:

7.5 mm - Narrow width for fitting into tight spaces on the PCB.

Minimum Supply Voltage (Vsup):

4.5 V - Supports a low minimum supply voltage for energy-efficient operation.

Maximum Time At Peak Reflow Temperature (s):

30 - Can withstand peak reflow temperatures for a short duration without damage.

Peak Reflow Temperature °C:

260 - High peak reflow temperature tolerance for reliable soldering during assembly.

Length:

12.8 mm - Compact length for space-saving installation on the PCB.

Temperature Grade:

COMMERCIAL - Suitable for commercial electronic products and applications.

Technology:

CMOS - Highly efficient CMOS technology for low power consumption and high performance.

Terminal Form:

GULL WING - Gull wing terminal form for easy soldering and strong mechanical connection.

Maximum Supply Current:

5 mA - Low maximum supply current requirement for efficient power usage.

Terminal Pitch:

1.27 mm - Standard terminal pitch for compatibility with common PCB layouts.

Moisture Sensitivity Level (MSL):

3 - Moderate moisture sensitivity level to prevent damage during storage and handling.

Maximum Supply Voltage (Vsup):

12 V - Supports a maximum supply voltage for robust performance in various applications.

Technical Specifications

Other Function Consumer ICs LM1973M/NOPB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-6

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

LM1973M/NOPB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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