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LM1971N

Texas Instruments

LM1971N by Texas Instruments

LM1971N by Texas Instruments is a consumer circuit IC with 8 terminals and a supply voltage range of 4.5V to 12V. Operating temperature ranges from -40°C to 85°C, making it suitable for industrial applications. This CMOS technology IC has a compact rectangular package style ideal for various consumer electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,671 parts In-Stock

1+ parts

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4,671

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Digiode

USA . 1,068 parts In-Stock

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1,068

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Anansix

USA . 894 parts In-Stock

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894

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ComSIT Distribution GmbH

Germany . 35 parts In-Stock

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35

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,360 parts In-Stock

1+ parts

$1.445

100+ parts

-

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$2.135

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2,360

$1.445

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$2.135

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DigiPath Technology Company

USA . 2,170 parts In-Stock

1+ parts

$1.592

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2,170

$1.592

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IDEA Electronic Components Group

UK . 1,323 parts In-Stock

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$1.624

100+ parts

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$1.462

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1,323

$1.624

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$1.462

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ChromeModa Solutions

Germany . 437 parts In-Stock

1+ parts

$1.624

100+ parts

$1.332

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437

$1.624

$1.332

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AZTECH Wire

Italy . 538 parts In-Stock

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$10.770

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538

$10.770

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One Stop Electronics

USA . 151 parts In-Stock

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$13.800

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151

$13.800

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Alle Elektronik GmbH

Germany . 4,663 parts In-Stock

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Corphita

USA . 1,549 parts In-Stock

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Overview

Unlock the potential of your consumer electronics with the LM1971N by Texas Instruments. Manufactured with precision and expertise, this versatile IC offers a wide range of applications in various consumer circuits. With a durable plastic/epoxy package body and innovative design, this IC ensures reliable performance even in harsh industrial environments. Experience the convenience of dual terminal position, low power consumption, and a wide temperature range. Trust Texas Instruments to provide quality products that deliver value and benefits to customers, making your devices smarter and more efficient.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits inside, ensuring reliability and longevity.

Power Supplies (V): 12

Supports a high power supply voltage of 12V, making it suitable for a wide range of consumer electronic applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, suitable for applications in harsh environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, leading to efficient performance.

Maximum Supply Current: 3 mA

Consumes low supply current, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Other Function Consumer ICs LM1971N attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Length:

9.817 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LM1971N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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