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LM1973N

Texas Instruments

LM1973N by Texas Instruments

LM1973N by Texas Instruments is a CMOS consumer circuit IC with 20 terminals in an in-line package. Operating temperature range of 0-70°C, voltage supply from 4.5V to 12V. Widely used in various consumer electronic applications due to its compact size and commercial-grade reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Digiode

USA . 4,930 parts In-Stock

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Vyrian

USA . 4,585 parts In-Stock

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4,585

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Anansix

USA . 431 parts In-Stock

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431

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Fibra_Brandt Electronic GMBH

Germany . 46 parts In-Stock

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MISTER SPROCKETS

USA . 33 parts In-Stock

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PC Components Company LLC

USA . 29 parts In-Stock

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Lakeland Logistics Inc

USA . 21 parts In-Stock

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Bristol Electronics

USA . 21 parts In-Stock

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Sinequanon

UK . 4 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,759 parts In-Stock

1+ parts

$0.754

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$1.757

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1,759

$0.754

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$1.757

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DigiPath Technology Company

USA . 1,685 parts In-Stock

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$0.830

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$0.764

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$0.830

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ChromeModa Solutions

Germany . 2,681 parts In-Stock

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$0.847

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$0.695

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IDEA Electronic Components Group

UK . 617 parts In-Stock

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$0.847

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$0.762

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617

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One Stop Electronics

USA . 128 parts In-Stock

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$2.800

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$2.800

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AZTECH Wire

Italy . 692 parts In-Stock

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$16.074

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Ampacity Inc.

Singapore . 971 parts In-Stock

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$16.800

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Lixinc

USA . 18,674 parts In-Stock

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,964 parts In-Stock

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Argo Parts USA

USA . 3,523 parts In-Stock

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Continental Prestige Electronics

USA . 2,415 parts In-Stock

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Corphita

USA . 1,776 parts In-Stock

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Kepictronics

USA . 270 parts In-Stock

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Futuretech Components

Singapore . 216 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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ChipstoGo Electronic ltd

UK . 46 parts In-Stock

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Overview

Enhance your electronic designs with the LM1973N by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This Other Function Consumer IC offers versatile applications in consumer circuits, providing reliability and efficiency to your projects. With a wide operating temperature range and durable package construction, this component ensures optimal performance in a variety of conditions. Trust Texas Instruments to deliver innovative solutions that elevate your creations to the next level. Experience the value and benefits of the LM1973N today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal circuitry, ensuring long term usage.

No. of Terminals: 20

Allows for multiple connections and functionality within a single IC, increasing versatility.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures, making it suitable for various operating environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency.

Terminal Form: THROUGH-HOLE

The through-hole design makes it easy to solder and secure connections, ensuring reliability.

Technical Specifications

Other Function Consumer ICs LM1973N attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T20

Length:

26.075 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LM1973N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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