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LM1973MX/NOPB

Texas Instruments

LM1973MX/NOPB by Texas Instruments

LM1973MX/NOPB by Texas Instruments is a CMOS consumer IC with +-6V power supplies. It has 20 terminals, operates b/w 0-70°C, and supports supply voltages from 4.5-12V. This small outline package is ideal for various consumer circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,658 parts In-Stock

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Digiode

USA . 4,563 parts In-Stock

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Anansix

USA . 1,270 parts In-Stock

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1,270

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ABC Electronics Ltd.

UK . 40 parts In-Stock

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40

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Parana Technologies

USA . 1,402 parts In-Stock

1+ parts

$1.299

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-

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$2.051

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1,402

$1.299

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$2.051

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DigiPath Technology Company

USA . 2,256 parts In-Stock

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$1.430

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$1.315

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$1.430

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IDEA Electronic Components Group

UK . 1,834 parts In-Stock

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$1.459

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$1.313

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1,834

$1.459

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$1.313

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ChromeModa Solutions

Germany . 1,679 parts In-Stock

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$1.459

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$1.196

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One Stop Electronics

USA . 735 parts In-Stock

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$12.800

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735

$12.800

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AZTECH Wire

Italy . 222 parts In-Stock

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$12.942

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Ampacity Inc.

Singapore . 1,513 parts In-Stock

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$18.800

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Alle Elektronik GmbH

Germany . 4,542 parts In-Stock

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Argo Parts USA

USA . 2,579 parts In-Stock

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Continental Prestige Electronics

USA . 2,414 parts In-Stock

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Corphita

USA . 1,852 parts In-Stock

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GreenTree Electronics

Israel . 1,552 parts In-Stock

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Perfect Parts

USA . 1,245 parts In-Stock

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Microchip USA

USA . 258 parts In-Stock

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258

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Discover the LM1973MX/NOPB by Texas Instruments, a top-quality consumer circuit perfect for various applications. With a package style of small outline and dual terminal position, this IC offers convenience and reliability. Manufactured by the reputable Texas Instruments, known for their cutting-edge technology and innovation, this product guarantees high performance and durability. From power supplies to temperature control, the LM1973MX/NOPB provides value and benefits to customers seeking superior quality in their electronic devices. Upgrade your projects with this versatile IC and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection for the IC, making it ideal for consumer applications.

Surface Mount: YES

Being surface mountable makes the IC easier to integrate onto circuit boards, saving space and facilitating automated assembly processes.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand moderate heat levels, ensuring reliable performance in various environments.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption and high noise immunity, making the IC energy-efficient and reliable for consumer applications.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement of 4.5 V enables the IC to operate efficiently with a wide range of power sources, enhancing its versatility.

Technical Specifications

Other Function Consumer ICs LM1973MX/NOPB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-6

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Audio Control ICs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

LM1973MX/NOPB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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