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LM1971MDC

Texas Instruments

LM1971MDC by Texas Instruments

Texas Instruments' LM1971MDC is a CMOS consumer IC with a supply voltage range of 4.5V to 12V. Operating temperature ranges from -20°C to 85°C, making it suitable for various consumer circuit applications. This surface-mount chip has an unencased package style and upper terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,445 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,445

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Digiode

USA . 2,980 parts In-Stock

1+ parts

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2,980

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Anansix

USA . 1,559 parts In-Stock

1+ parts

-

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1,559

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 224 parts In-Stock

1+ parts

$3.233

100+ parts

-

1k+ parts

$3.756

10k+ parts

-

224

$3.233

-

$3.756

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DigiPath Technology Company

USA . 2,303 parts In-Stock

1+ parts

$3.560

100+ parts

$3.276

1k+ parts

-

10k+ parts

-

2,303

$3.560

$3.276

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ChromeModa Solutions

Germany . 6,956 parts In-Stock

1+ parts

$3.633

100+ parts

$2.979

1k+ parts

-

10k+ parts

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6,956

$3.633

$2.979

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IDEA Electronic Components Group

UK . 937 parts In-Stock

1+ parts

$3.633

100+ parts

-

1k+ parts

$3.270

10k+ parts

-

937

$3.633

-

$3.270

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AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$12.414

100+ parts

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460

$12.414

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One Stop Electronics

USA . 932 parts In-Stock

1+ parts

$17.800

100+ parts

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932

$17.800

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Corphita

USA . 1,235 parts In-Stock

1+ parts

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1,235

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Overview

Discover the LM1971MDC by Texas Instruments, a top-quality consumer circuit designed to elevate your electronic projects. With Texas Instruments' reputation for excellence in manufacturing, this surface mount IC offers unmatched reliability and performance. Whether you're designing audio equipment, home appliances, or automotive systems, the LM1971MDC provides the precision and efficiency you need. Experience the value of seamless integration, superior functionality, and effortless operation with this cutting-edge product. Elevate your designs with the LM1971MDC and unlock limitless possibilities.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting onto PCBs, making the product suitable for automated assembly processes.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and compatibility with devices used by the general public.

Package Style (Meter): UNCASED CHIP

The small and compact unencased chip package style enables space-saving designs and can be easily integrated into various consumer electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated temperatures without compromising performance, ensuring reliability in various operating conditions.

Minimum Operating Temperature: -20 °C

The wide range of operating temperatures allows the product to function effectively in both extreme cold and hot environments, increasing its versatility and usability.

Terminal Position: UPPER

The upper terminal position simplifies connection to external components or devices, making installation and integration hassle-free.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement of 4.5V enables the product to operate efficiently in low-power applications, saving energy and extending battery life.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers lower power consumption, faster switching speeds, and higher noise immunity, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

The absence of leads simplifies the manufacturing process and reduces the risk of solder joints, leading to improved reliability and performance.

Maximum Supply Voltage (Vsup): 12 V

The high maximum supply voltage of 12V allows for compatibility with a wide range of power sources, making the product versatile and adaptable to various electrical systems.

Technical Specifications

Other Function Consumer ICs LM1971MDC attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

LM1971MDC General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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