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E-TDA7476013TR

STMicroelectronics

E-TDA7476013TR by STMicroelectronics

E-TDA7476013TR by STMicroelectronics is a BCDMOS consumer IC with 24 terminals in a small outline package. It features a rectangular shape, gull wing terminal form, and 1.27mm pitch. Ideal for applications requiring compact design and surface mount technology.

Median Price

$2.805

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$2.805

100+ parts

-

1k+ parts

-

10k+ parts

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74

$2.805

-

-

-

Vyrian

USA . 3,866 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,866

-

-

-

-

Digiode

USA . 3,342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,342

-

-

-

-

Anansix

USA . 123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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123

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 447 parts In-Stock

1+ parts

$0.369

100+ parts

-

1k+ parts

$0.332

10k+ parts

-

447

$0.369

-

$0.332

-

MKK Technologies

India . 273 parts In-Stock

1+ parts

$0.694

100+ parts

-

1k+ parts

-

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273

$0.694

-

-

-

DigiPath Technology Company

USA . 273 parts In-Stock

1+ parts

$0.694

100+ parts

-

1k+ parts

-

10k+ parts

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273

$0.694

-

-

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Continental Prestige Electronics

USA . 4,768 parts In-Stock

1+ parts

$2.805

100+ parts

-

1k+ parts

-

10k+ parts

$2.749

4,768

$2.805

-

-

$2.749

Argo Parts USA

USA . 4,316 parts In-Stock

1+ parts

$2.805

100+ parts

-

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-

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4,316

$2.805

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-

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AZTECH Wire

Italy . 565 parts In-Stock

1+ parts

$6.949

100+ parts

-

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10k+ parts

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565

$6.949

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-

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Ampacity Inc.

Singapore . 788 parts In-Stock

1+ parts

$9.800

100+ parts

-

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788

$9.800

-

-

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Microchip USA

USA . 2,021 parts In-Stock

1+ parts

$18.232

100+ parts

-

1k+ parts

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2,021

$18.232

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A-Z Elektronik GmbH

Germany . 5,294 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,294

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-

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Alle Elektronik GmbH

Germany . 3,529 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,529

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-

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

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1,500

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-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.749

1k+ parts

$2.665

10k+ parts

$2.609

1,000

-

$2.749

$2.665

$2.609

Parana Technologies

USA . 986 parts In-Stock

1+ parts

-

100+ parts

$0.441

1k+ parts

-

10k+ parts

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986

-

$0.441

-

-

Corphita

USA . 722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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722

-

-

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-

Overview

Upgrade your consumer electronics with the E-TDA7476013TR by STMicroelectronics, a high-quality consumer IC designed to enhance performance and functionality. STMicroelectronics is a trusted manufacturer known for delivering innovative solutions in the electronics industry. This versatile IC is perfect for a wide range of applications, offering customers value and reliability. With its compact design and advanced technology, the E-TDA7476013TR provides numerous benefits and advantages, making it the ideal choice for your next project. Elevate your products with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly on circuit boards.

Package Shape: RECTANGULAR

Rectangular package shape allows for space-efficient placement on PCBs.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, ensuring compatibility with a wide range of electronic devices.

No. of Terminals: 24

Ample number of terminals provide flexibility in connecting to other components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and can be integrated into compact devices.

Terminal Position: DUAL

Dual terminal position allows for more secure connection and better stability.

Maximum Seated Height: 2.65 mm

Low seated height enables a slim design for the overall product.

Width: 7.5 mm

Narrow width makes it suitable for applications where space is limited.

Length: 15.4 mm

Compact length enables easy integration into various electronic devices.

Technology: BCDMOS

BCDMOS technology offers high performance and efficiency in consumer applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering onto PCBs.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high density mounting and precise connections.

Technical Specifications

Other Function Consumer ICs E-TDA7476013TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

E-TDA7476013TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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