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E-TDA7461NDTR

STMicroelectronics

E-TDA7461NDTR by STMicroelectronics

E-TDA7461NDTR by STMicroelectronics is a BICMOS consumer IC designed for industrial applications, operating b/w 7.5V and 10V. It features a compact 28-terminal SO package with a max temp of 85 °C and min temp of -40°C. Ideal for surface mount designs, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,916 parts In-Stock

1+ parts

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3,916

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Vyrian

USA . 2,475 parts In-Stock

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2,475

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Anansix

USA . 2,153 parts In-Stock

1+ parts

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2,153

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 785 parts In-Stock

1+ parts

$1.094

100+ parts

-

1k+ parts

$0.984

10k+ parts

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785

$1.094

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$0.984

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MKK Technologies

India . 1,977 parts In-Stock

1+ parts

$2.057

100+ parts

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1,977

$2.057

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DigiPath Technology Company

USA . 1,977 parts In-Stock

1+ parts

$2.057

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1,977

$2.057

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Corphita

USA . 2,085 parts In-Stock

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2,085

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Parana Technologies

USA . 1,908 parts In-Stock

1+ parts

-

100+ parts

$1.308

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1,908

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$1.308

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Northwest PG Solutions

USA . 476 parts In-Stock

1+ parts

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476

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Native Components

USA . 195 parts In-Stock

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195

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Overview

Unlock superior audio experiences with the E-TDA7461NDTR from STMicroelectronics, a leader in innovative semiconductor solutions. This compact consumer circuit integrates seamlessly into diverse applications, delivering unparalleled performance and reliability in any environment. Designed for industrial-grade resilience, it ensures high-quality sound across a range of devices. Elevate your projects with this essential IC that combines robustness with exceptional value, making it the ideal choice for discerning engineers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, enhancing overall product performance.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout on circuit boards, providing a versatile solution for space-constrained designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliability and functionality in everyday electronic devices.

Power Supplies (V): 9

Operating at 9V makes it compatible with a wide range of consumer electronics, increasing its usability across various devices.

No. of Terminals: 28

With 28 terminals, it offers sufficient connectivity options for complex circuit designs while maintaining a manageable size.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes PCB real estate, perfect for modern compact electronic applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance under demanding conditions, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the IC is designed to function in extreme cold, extending its application range.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB layouts and integration into various designs, enhancing versatility.

Maximum Seated Height: 2.65 mm

A low seated height enables the design of slimmer electronic devices, important for portability in consumer products.

Width: 7.5 mm

The compact width facilitates efficient space utilization on PCBs, contributing to the trend of miniaturizing electronics.

Minimum Supply Voltage (Vsup): 7.5 V

Operating effectively at a minimum supply voltage of 7.5 V broadens its compatibility with various power supply designs.

Length: 17.9 mm

A manageable length helps maintain compact footprints in consumer devices while allowing for robust functionality.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates reliability and performance under rigorous conditions, making it ideal for demanding applications.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS, providing high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly, reducing manufacturing time and improving assembly efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm results in a balanced design for high-density mounting without sacrificing reliability.

Maximum Supply Voltage (Vsup): 10 V

The 10 V maximum supply voltage allows for flexibility in power supply choices, catering to a wide array of applications.

Technical Specifications

Other Function Consumer ICs E-TDA7461NDTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

E-TDA7461NDTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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