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E-TDA7478DTR

STMicroelectronics

E-TDA7478DTR by STMicroelectronics

E-TDA7478DTR by STMicroelectronics is a compact consumer IC designed for industrial applications, featuring a dual terminal configuration and operating temp range of -40 °C to 85°C. It supports supply voltages from 4.5V to 5.5V and comes in a thin profile package. Ideal for space-constrained designs, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,907 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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4,907

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Vyrian

USA . 4,713 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,713

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Anansix

USA . 367 parts In-Stock

1+ parts

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367

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,067 parts In-Stock

1+ parts

$2.955

100+ parts

-

1k+ parts

$2.660

10k+ parts

-

1,067

$2.955

-

$2.660

-

Native Components

USA . 601 parts In-Stock

1+ parts

$4.977

100+ parts

-

1k+ parts

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10k+ parts

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601

$4.977

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MKK Technologies

India . 1,436 parts In-Stock

1+ parts

$5.557

100+ parts

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1,436

$5.557

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DigiPath Technology Company

USA . 1,436 parts In-Stock

1+ parts

$5.557

100+ parts

-

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10k+ parts

-

1,436

$5.557

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AZTECH Wire

Italy . 523 parts In-Stock

1+ parts

$12.750

100+ parts

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523

$12.750

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Corphita

USA . 2,863 parts In-Stock

1+ parts

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2,863

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Northwest PG Solutions

USA . 1,305 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.878

10k+ parts

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1,305

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$4.878

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Parana Technologies

USA . 988 parts In-Stock

1+ parts

-

100+ parts

$3.533

1k+ parts

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988

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$3.533

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Kepictronics

USA . 587 parts In-Stock

1+ parts

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587

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Overview

Unlock next-level audio experiences with the E-TDA7478DTR from STMicroelectronics. Renowned for their innovation and reliability, STMicroelectronics delivers this high-quality consumer IC designed for seamless integration in audio applications. With robust performance in extreme temperatures and a compact footprint, it ensures superior sound clarity and efficiency. Elevate your projects with a trusted solution that empowers creativity while optimizing space—experience the ST advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and reliability, making the IC suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for smaller PCB layouts, increasing design flexibility and minimizing space requirements.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the circuit board, facilitating compact design.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and optimized performance in everyday devices.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options, allowing for versatile integration into various circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this IC ideal for compact devices, enabling manufacturers to create slim and lightweight products.

Maximum Operating Temperature: 85 °C

This high temperature tolerance ensures reliable performance in warm environments, making it suitable for diverse applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliable functionality in extreme conditions, making it versatile for various climates.

Terminal Position: DUAL

Dual terminal positioning enhances compatibility with various PCB layouts, providing design flexibility.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a slim profile, which is essential for modern, compact electronic devices.

Width: 4.4 mm

The narrow width allows for dense packing on PCBs, resulting in smaller overall device designs.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum voltage requirement allows operation in battery-powered and energy-efficient applications.

Length: 5 mm

A short length aids in compactness, making this IC suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures robust performance in challenging environments, increasing reliability.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for portable and consumer electronics.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve reliability, ensuring strong mechanical connections.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for denser layout designs, aiding in the miniaturization of electronic devices.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum voltage allows for flexibility in power supply design while ensuring reliable operation across various consumer electronics.

Technical Specifications

Other Function Consumer ICs E-TDA7478DTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

E-TDA7478DTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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