Loading...

E-TDA7479D

STMicroelectronics

E-TDA7479D by STMicroelectronics

E-TDA7479D by STMicroelectronics is a consumer IC designed for industrial applications, operating b/w -40 °C to 85°C. It features a compact 16-terminal SO package, with a supply voltage range of 4.5V to 5.5V and max current of 11mA. Ideal for surface mount designs, it ensures reliability in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,364

-

-

-

-

Vyrian

USA . 2,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,150

-

-

-

-

Anansix

USA . 1,686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,686

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 351 parts In-Stock

1+ parts

$2.558

100+ parts

-

1k+ parts

$2.302

10k+ parts

-

351

$2.558

-

$2.302

-

Microchip USA

USA . 162 parts In-Stock

1+ parts

$4.063

100+ parts

-

1k+ parts

-

10k+ parts

-

162

$4.063

-

-

-

MKK Technologies

India . 1,965 parts In-Stock

1+ parts

$4.809

100+ parts

-

1k+ parts

-

10k+ parts

-

1,965

$4.809

-

-

-

DigiPath Technology Company

USA . 1,965 parts In-Stock

1+ parts

$4.809

100+ parts

-

1k+ parts

-

10k+ parts

-

1,965

$4.809

-

-

-

Corphita

USA . 2,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,014

-

-

-

-

Northwest PG Solutions

USA . 390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

390

-

-

-

-

Native Components

USA . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

240

-

-

-

-

Parana Technologies

USA . 113 parts In-Stock

1+ parts

-

100+ parts

$3.058

1k+ parts

-

10k+ parts

-

113

-

$3.058

-

-

Overview

Elevate your design with the E-TDA7479D from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile consumer IC delivers reliability and efficiency across various applications, making it perfect for industrial-grade projects. With its robust performance in extreme temperatures and compact design, the E-TDA7479D ensures seamless integration and longevity in your devices, adding unmatched value to your next project. Experience quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making it suitable for consumer applications.

Surface Mount: YES

Surface mount technology enables compact design and easy integration into modern electronic devices, enhancing versatility.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, making it a favorable choice for space-constrained applications.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC offers optimized performance to meet the demands of end-user electronics.

Power Supplies (V): 5

Operates at standard 5V power supply, commonly used in various consumer electronics, ensuring compatibility and easy integration.

No. of Terminals: 16

With 16 terminals, this IC provides sufficient connectivity options for complex consumer functions while maintaining a compact design.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications where size is critical, facilitating efficient circuit designs.

Maximum Operating Temperature: 85 °C

Capable of functioning at higher temperatures, this IC is suitable for various environments, ensuring reliability in diverse conditions.

Minimum Operating Temperature: -40 °C

With the ability to operate in extreme low temperatures, this IC can be utilized in outdoor and industrial applications, ensuring broad usability.

Terminal Finish: SILVER

Silver terminal finish enhances conductivity and ensures reliable electrical connections, which is vital for signal integrity.

Terminal Position: DUAL

The dual terminal position facilitates easy PCB layout and integration, reducing design complexity for engineers.

Maximum Seated Height: 2.65 mm

A low maximum seated height allows for slim designs, making this IC suitable for compact consumer products.

Width: 7.5 mm

A width of 7.5 mm allows for space-efficient designs, making it easier to fit into smaller device form factors.

Minimum Supply Voltage (Vsup): 4.5 V

Lower minimum supply voltage ensures flexibility in operation range, allowing for battery-powered and energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s): 50

This specification indicates robust thermal performance during soldering processes, enhancing reliability post-assembly.

Peak Reflow Temperature °C: 250

A higher peak reflow temperature allows compatibility with most modern soldering techniques, simplifying manufacturing.

Length: 10.3 mm

The length of 10.3 mm strikes a balance between functionality and compactness, suitable for various electronic applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliability in harsh environments, making it suitable for long-term applications.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making it ideal for energy-efficient consumer applications.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy handling and soldering, ensuring efficient assembly on production lines.

Maximum Supply Current: 11 mA

With a maximum supply current of 11 mA, this IC is energy-efficient, which is crucial for battery-operated devices.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch improves layout flexibility and ensures compatibility with a range of mounting technologies.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating signifies robustness against moisture-related issues during storage and handling, which is critical in manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows for operational flexibility, accommodating variations in power supply levels commonly found in consumer products.

Technical Specifications

Other Function Consumer ICs E-TDA7479D attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

11 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

50

Width:

7.5 mm

Trade Compliance

E-TDA7479D General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19