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E-TDA7479DTR

STMicroelectronics

E-TDA7479DTR by STMicroelectronics

E-TDA7479DTR by STMicroelectronics is a dual-terminal consumer IC designed for industrial applications, operating b/w -40 °C and 85°C. It features a compact 16-pin SO package with a supply voltage range of 4.5V to 5.5V. Ideal for surface mount technology, it ensures reliable performance in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 6,950 parts In-Stock

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6,950

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Vyrian

USA . 4,965 parts In-Stock

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4,965

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Digiode

USA . 4,725 parts In-Stock

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4,725

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Cyclops Electronics Ltd

UK . 4,098 parts In-Stock

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4,098

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ComSIT USA

USA . 3,950 parts In-Stock

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3,950

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Anansix

USA . 1,819 parts In-Stock

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1,819

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 91 parts In-Stock

1+ parts

$1.777

100+ parts

-

1k+ parts

$1.600

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91

$1.777

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$1.600

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MKK Technologies

India . 581 parts In-Stock

1+ parts

$3.342

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581

$3.342

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DigiPath Technology Company

USA . 581 parts In-Stock

1+ parts

$3.342

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581

$3.342

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Microchip USA

USA . 290 parts In-Stock

1+ parts

$7.636

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290

$7.636

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QUARKTWIN TECHNOLOGY LTD

USA . 16,452 parts In-Stock

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16,452

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Metaverse IC Inc.

Canada . 8,985 parts In-Stock

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8,985

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Kepictronics

USA . 6,985 parts In-Stock

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6,985

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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2,700

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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1,800

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Parana Technologies

USA . 1,756 parts In-Stock

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$2.125

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1,756

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$2.125

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Corphita

USA . 1,261 parts In-Stock

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1,261

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Native Components

USA . 490 parts In-Stock

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490

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Northwest PG Solutions

USA . 480 parts In-Stock

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480

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Overview

Unlock unparalleled performance and reliability with the E-TDA7479DTR from STMicroelectronics, a leader in innovation. This consumer IC seamlessly integrates into diverse applications, delivering exceptional efficiency even in demanding environments. Crafted with a robust design, it ensures top-notch quality and longevity, making it ideal for industrial use. Elevate your projects with a solution that combines advanced technology with the trusted reputation of STMicroelectronics, ensuring you stay ahead in a competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures good durability and resistance to environmental factors, making this IC suitable for a range of consumer applications.

Surface Mount: YES

Surface mount technology allows for high-density PCB designs and automated manufacturing processes, saving space and reducing production costs.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of board space and is compatible with standard PCB layouts.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronics, this IC is optimized for performance and functionality in everyday devices.

No. of Terminals: 16

With 16 terminals, this IC offers enough connections to accommodate versatile functionality while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package design enhances space efficiency on PCBs, making it a perfect choice for compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in various environmental conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C ensures this IC can withstand harsh cold conditions, making it a robust choice for outdoor and industrial use.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible PCB layouts and simplifies routing for signal connections.

Maximum Seated Height: 2.65 mm

A low seated height keeps the profile of the device low, which is advantageous for space-constrained applications.

Width: 7.5 mm

A width of 7.5 mm is well-balanced for compact designs, while still allowing for easy handling and soldering.

Minimum Supply Voltage (Vsup): 4.5 V

Starting at a minimum supply voltage of 4.5 V allows for a broad range of operation, making it suitable for various power supply configurations.

Length: 10.3 mm

A length of 10.3 mm optimizes space on PCBs while providing sufficient connections for functionality.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates that this IC is designed for high reliability and performance in rigorous environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this IC energy efficient and ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide a reliable mechanical connection, which is advantageous for production processes.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch strikes a balance between compact design and ease of manufacturing, allowing for compatibility with standard assembly techniques.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V ensures it can handle various voltage levels, providing versatility in different circuit designs.

Technical Specifications

Other Function Consumer ICs E-TDA7479DTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

E-TDA7479DTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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