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TFP401AMPZPEP

Texas Instruments

TFP401AMPZPEP by Texas Instruments

TFP401AMPZPEP by Texas Instruments is a consumer IC with 100 terminals, operating at -55 to 125 °C. It features a 3.3V supply, GULL WING terminals, and MILITARY grade temperature tolerance. Ideal for applications requiring CMOS technology in compact spaces with strict operating conditions.

Median Price

$21.840

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,453 parts In-Stock

1+ parts

$18.230

100+ parts

$15.924

1k+ parts

$10.982

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-

2,453

$18.230

$15.924

$10.982

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Arrow

USA . 23 parts In-Stock

1+ parts

$21.840

100+ parts

$16.940

1k+ parts

$16.290

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23

$21.840

$16.940

$16.290

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Verical

USA . 23 parts In-Stock

1+ parts

$21.840

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-

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23

$21.840

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DigiKey

USA . 5,369 parts In-Stock

1+ parts

$26.830

100+ parts

$18.966

1k+ parts

$17.839

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5,369

$26.830

$18.966

$17.839

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Mouser Electronics

USA . 979 parts In-Stock

1+ parts

$26.830

100+ parts

$18.960

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$17.830

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979

$26.830

$18.960

$17.830

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Chip1Stop

Japan . 112 parts In-Stock

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$16.816

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112

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$16.816

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 41 parts In-Stock

1+ parts

$15.840

100+ parts

-

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41

$15.840

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Digiode

USA . 1,366 parts In-Stock

1+ parts

$17.318

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1,366

$17.318

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Vyrian

USA . 1,273 parts In-Stock

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1,273

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Chip Stock

USA . 621 parts In-Stock

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621

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Bristol Electronics

USA . 137 parts In-Stock

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137

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Holdelec - ElecDif-Pro

France . 10 parts In-Stock

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10

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North Shore Components

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,641 parts In-Stock

1+ parts

$0.224

100+ parts

-

1k+ parts

$1.522

10k+ parts

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1,641

$0.224

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$1.522

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DigiPath Technology Company

USA . 1,987 parts In-Stock

1+ parts

$0.247

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1,987

$0.247

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ChromeModa Solutions

Germany . 5,102 parts In-Stock

1+ parts

$0.252

100+ parts

$0.207

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5,102

$0.252

$0.207

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IDEA Electronic Components Group

UK . 1,255 parts In-Stock

1+ parts

$0.252

100+ parts

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$0.227

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1,255

$0.252

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$0.227

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Semicontronic

India . 1,237 parts In-Stock

1+ parts

$14.290

100+ parts

$13.933

1k+ parts

$13.861

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1,237

$14.290

$13.933

$13.861

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Ampacity Inc.

Singapore . 1,025 parts In-Stock

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$14.290

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1,025

$14.290

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Continental Prestige Electronics

USA . 4,043 parts In-Stock

1+ parts

$15.840

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$15.523

4,043

$15.840

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$15.523

Netroflash

USA . 500 parts In-Stock

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$15.840

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500

$15.840

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Modulus Dynamics

Lithuania . 4,319 parts In-Stock

1+ parts

$16.240

100+ parts

$16.240

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$16.240

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4,319

$16.240

$16.240

$16.240

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Corohmni

South Africa . 1,015 parts In-Stock

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$16.240

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1,015

$16.240

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Corphita

USA . 2,275 parts In-Stock

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$16.407

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2,275

$16.407

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$16.727

100+ parts

$15.891

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$15.891

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2,500

$16.727

$15.891

$15.891

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Kepictronics

USA . 2,000 parts In-Stock

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Lixinc

USA . 1,824 parts In-Stock

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Argo Parts USA

USA . 494 parts In-Stock

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494

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Overview

Experience top-notch quality with the TFP401AMPZPEP by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments delivers exceptional consumer ICs like this one that offer unparalleled value and benefits to customers. From its innovative design to its wide range of applications, this product stands out for its reliability and performance. Whether you're looking to enhance your electronic devices or streamline your circuit designs, the TFP401AMPZPEP is the perfect choice for all your needs. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good thermal and electrical insulation, making the product safe and reliable for consumer use.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and space.

Package Shape: SQUARE

The square package shape helps in efficient use of space on the circuit board.

Power Supplies (V): 3.3

The 3.3V power supply is common and easily compatible with many consumer devices.

No. of Terminals: 100

Having 100 terminals allows for more connections and functionalities in the circuit design.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and performance even in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature widens the range of environments in which the product can function effectively.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides good conductivity and corrosion resistance, enhancing the durability of the terminals.

Maximum Seated Height: 1.2 mm

The low seated height allows for a compact design of the product, suitable for space-constrained applications.

Width: 14 mm

The 14mm width is standard and compatible with most circuit board layouts.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for efficient soldering processes during manufacturing.

Length: 14 mm

The 14mm length complements the width and shape of the package, providing a balanced design.

Temperature Grade: MILITARY

The military-grade temperature tolerance ensures reliable performance in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Terminal Form: GULL WING

The gull wing terminals provide mechanical stability and ease of soldering during assembly.

Maximum Supply Current: 370 mA

The 370mA maximum supply current allows for powering multiple components without overloading.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables fine-pitch mounting, suitable for compact circuit designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, ensuring proper handling and storage procedures are followed.

Maximum Supply Voltage (Vsup): 3.6 V

The 3.6V maximum supply voltage provides a safety margin for power input variations.

Technical Specifications

Other Function Consumer ICs TFP401AMPZPEP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

370 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TFP401AMPZPEP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-657-9976, 5962016579976

NIIN

016579976

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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