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E-TDA7402TR

STMicroelectronics

E-TDA7402TR by STMicroelectronics

E-TDA7402TR by STMicroelectronics is a low-profile consumer IC designed for industrial applications, operating b/w -40 °C to 85°C. It features a 9V power supply, 44 terminals in a square package, and supports surface mount technology. Ideal for compact electronic devices requiring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,989 parts In-Stock

1+ parts

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4,989

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Anansix

USA . 2,816 parts In-Stock

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2,816

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Digiode

USA . 1,025 parts In-Stock

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1,025

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,839 parts In-Stock

1+ parts

$0.319

100+ parts

-

1k+ parts

$0.287

10k+ parts

-

1,839

$0.319

-

$0.287

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MKK Technologies

India . 1,162 parts In-Stock

1+ parts

$0.600

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-

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1,162

$0.600

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DigiPath Technology Company

USA . 1,162 parts In-Stock

1+ parts

$0.600

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1,162

$0.600

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Native Components

USA . 630 parts In-Stock

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$0.662

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630

$0.662

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Northwest PG Solutions

USA . 2,355 parts In-Stock

1+ parts

$0.728

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2,355

$0.728

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Microchip USA

USA . 200 parts In-Stock

1+ parts

$3.336

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200

$3.336

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AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$12.570

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626

$12.570

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Corphita

USA . 4,953 parts In-Stock

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4,953

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Parana Technologies

USA . 1,417 parts In-Stock

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$0.382

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1,417

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$0.382

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Overview

Elevate your projects with the E-TDA7402TR from STMicroelectronics, a trusted name in consumer IC solutions. This high-quality component ensures exceptional reliability and performance in various applications, from audio systems to home automation. Designed for durability across temperature ranges, it seamlessly integrates into your designs, delivering superior sound quality and efficiency. Trust STMicroelectronics for innovation that empowers your creativity and enhances user experiences.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material offers durability and resistance to moisture, making this product reliable in various environments.

Surface Mount: YES

Being surface mount allows for a compact design and easy integration into modern PCBs, enhancing manufacturing efficiency.

Package Shape: SQUARE

The square package shape is ideal for symmetrical layouts on PCBs, providing efficiency in space utilization.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC effectively meets the performance needs of everyday electronic devices.

Power Supplies (V): 9

Operating at a nominal voltage of 9V makes this IC compatible with a wide range of consumer products, ensuring versatility.

No. of Terminals: 44

With 44 terminals, this IC allows for complex connections and functionality, catering to advanced circuit designs.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE

The low-profile flatpack design aids in heat dissipation, crucial for maintaining performance in high power applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can perform well in warm environments, increasing reliability.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40 °C makes this IC suitable for extreme conditions, enhancing its application range.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides a good solderability and resistance to oxidation, ensuring better long-term performance.

Terminal Position: QUAD

Quad terminal positioning allows for easier connections and space-efficient layouts on printed circuit boards.

Maximum Seated Height: 1.6 mm

A low seated height enhances compatibility with compact designs, making it ideal for space-constrained applications.

Width: 10 mm

The 10 mm width aligns well with standard PCB layouts, enabling easier integration into existing designs.

Minimum Supply Voltage (Vsup): 7.5 V

A minimum supply of 7.5V ensures compatibility with various power sources, maximizing usage in diverse systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a peak reflow time of 30 seconds, this IC can withstand soldering processes without compromising integrity.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows for improved soldering quality, ensuring robust connections on the PCB.

Length: 10 mm

The 10 mm length maintains a compact profile, supporting modern design trends toward smaller electronic devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures consistent performance over a wide range of operational conditions.

Terminal Form: GULL WING

Gull wing terminals enhance soldering ease and mechanical strength, providing durability in electronic circuits.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch enables finer PCB designs, supporting advanced functionality in smaller package sizes.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, guiding proper handling and storage for ensuring operational reliability.

Maximum Supply Voltage (Vsup): 10 V

With a maximum supply voltage of 10V, this IC provides flexibility in power supply configurations, optimizing application usage.

Technical Specifications

Other Function Consumer ICs E-TDA7402TR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

E-TDA7402TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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