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E-TDA7478ADTR

STMicroelectronics

E-TDA7478ADTR by STMicroelectronics

E-TDA7478ADTR by STMicroelectronics is a compact consumer IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a 16-terminal gull-wing package with a max supply voltage of 5.5V and utilizes CMOS technology. Ideal for space-constrained designs, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,870

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-

-

-

Digiode

USA . 3,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,343

-

-

-

-

Anansix

USA . 2,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,651

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,291 parts In-Stock

1+ parts

$0.476

100+ parts

-

1k+ parts

$0.428

10k+ parts

-

1,291

$0.476

-

$0.428

-

MKK Technologies

India . 2,018 parts In-Stock

1+ parts

$0.894

100+ parts

-

1k+ parts

-

10k+ parts

-

2,018

$0.894

-

-

-

DigiPath Technology Company

USA . 2,018 parts In-Stock

1+ parts

$0.894

100+ parts

-

1k+ parts

-

10k+ parts

-

2,018

$0.894

-

-

-

AZTECH Wire

Italy . 1,115 parts In-Stock

1+ parts

$8.370

100+ parts

-

1k+ parts

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10k+ parts

-

1,115

$8.370

-

-

-

Corphita

USA . 2,153 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,153

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-

-

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Northwest PG Solutions

USA . 2,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,011

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-

-

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Native Components

USA . 812 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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812

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-

-

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Parana Technologies

USA . 103 parts In-Stock

1+ parts

-

100+ parts

$0.569

1k+ parts

-

10k+ parts

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103

-

$0.569

-

-

Overview

Elevate your consumer electronics with the E-TDA7478ADTR by STMicroelectronics, a leader in innovation and reliability. Designed for optimal performance in various applications, this compact IC ensures exceptional quality and durability, even in extreme temperatures. Experience enhanced efficiency and versatility that meets your demands while benefiting from STMicroelectronics’ commitment to excellence. Choose the E-TDA7478ADTR for superior value and unmatched performance in your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy indicates durability and resistance to environmental factors, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount technology allows for automated assembly and minimizes board space, which is advantageous in modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on the PCB, facilitating better layout and component placement.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring that it meets the necessary performance and reliability standards.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various functions and enhanced circuit integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This packaging style is ideal for compact designs, allowing manufacturers to create smaller and sleeker consumer products.

Maximum Operating Temperature: 85 °C

A maximum temperature rating of 85 °C ensures reliable operation even in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C expands the product's usability in extreme conditions, significantly enhancing its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality finish ensures excellent conductivity and reduces oxidation and corrosion, promoting long-term reliability.

Terminal Position: DUAL

Dual terminal positioning aids in versatile circuit designs and improves solderability, enhancing assembly processes.

Maximum Seated Height: 1.2 mm

The low profile (1.2 mm) supports compact designs, allowing for integration into thinner electronic devices.

Width: 4.4 mm

A narrow width allows for higher density placement of components on a PCB, optimizing space for other functionalities.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V makes it compatible with various consumer power supplies, enhancing flexibility in design.

Length: 5 mm

The short length contributes to a compact footprint on the PCB, making it easier to fit into smaller consumer devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade attests to the IC's reliability and robustness, suitable for demanding environments.

Technology: CMOS

CMOS technology allows for low power consumption while providing high-speed performance, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and more reliable electrical connections, improving overall performance.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm assists in maintaining compact layouts without sacrificing connectivity, enhancing design efficiency.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates the component is moderately sensitive to moisture, necessitating careful handling to ensure reliability during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides flexibility to interface with various power supplies while maintaining safe operation.

Technical Specifications

Other Function Consumer ICs E-TDA7478ADTR attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

E-TDA7478ADTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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