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TMDS181RGZR

Texas Instruments

TMDS181RGZR by Texas Instruments

TMDS181RGZR by Texas Instruments is a consumer IC with 1 function, 48 terminals, and 4 channels. It operates b/w 0-70°C, has a supply voltage range of 1-1.27V, and can withstand peak reflow temperature of 260°C. Ideal for various consumer circuit applications requiring high performance in a compact chip carrier package.

Median Price

$6.510

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,937 parts In-Stock

1+ parts

$5.165

100+ parts

$4.211

1k+ parts

$2.807

10k+ parts

-

10,937

$5.165

$4.211

$2.807

-

DigiKey

USA . 7,966 parts In-Stock

1+ parts

$6.510

100+ parts

$4.219

1k+ parts

$3.805

10k+ parts

$3.701

7,966

$6.510

$4.219

$3.805

$3.701

Mouser Electronics

USA . 3,676 parts In-Stock

1+ parts

$6.510

100+ parts

$4.220

1k+ parts

$3.810

10k+ parts

$3.690

3,676

$6.510

$4.220

$3.810

$3.690

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$4.210

100+ parts

-

1k+ parts

-

10k+ parts

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870

$4.210

-

-

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Digiode

USA . 2,965 parts In-Stock

1+ parts

$4.907

100+ parts

-

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-

10k+ parts

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2,965

$4.907

-

-

-

Chip Stock

USA . 18,500 parts In-Stock

1+ parts

-

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18,500

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Component Sense

UK . 17,087 parts In-Stock

1+ parts

-

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17,087

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-

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Cyclops Electronics Ltd

UK . 13,722 parts In-Stock

1+ parts

-

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13,722

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Vyrian

USA . 7,276 parts In-Stock

1+ parts

-

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7,276

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,178 parts In-Stock

1+ parts

$0.404

100+ parts

$37.523

1k+ parts

$0.364

10k+ parts

-

1,178

$0.404

$37.523

$0.364

-

DigiPath Technology Company

USA . 1,037 parts In-Stock

1+ parts

$0.445

100+ parts

-

1k+ parts

-

10k+ parts

-

1,037

$0.445

-

-

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ChromeModa Solutions

Germany . 3,229 parts In-Stock

1+ parts

$0.454

100+ parts

$0.372

1k+ parts

-

10k+ parts

-

3,229

$0.454

$0.372

-

-

IDEA Electronic Components Group

UK . 2,265 parts In-Stock

1+ parts

$0.454

100+ parts

-

1k+ parts

$0.409

10k+ parts

-

2,265

$0.454

-

$0.409

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$1.753

100+ parts

$1.665

1k+ parts

$1.665

10k+ parts

-

1,000

$1.753

$1.665

$1.665

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Corohmni

South Africa . 88 parts In-Stock

1+ parts

$3.949

100+ parts

-

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-

10k+ parts

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88

$3.949

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-

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Continental Prestige Electronics

USA . 5,020 parts In-Stock

1+ parts

$4.210

100+ parts

-

1k+ parts

-

10k+ parts

$4.126

5,020

$4.210

-

-

$4.126

Argo Parts USA

USA . 1,846 parts In-Stock

1+ parts

$4.210

100+ parts

-

1k+ parts

-

10k+ parts

-

1,846

$4.210

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

$4.210

100+ parts

$4.126

1k+ parts

-

10k+ parts

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50

$4.210

$4.126

-

-

Semicontronic

India . 7,454 parts In-Stock

1+ parts

$4.390

100+ parts

$4.280

1k+ parts

$4.258

10k+ parts

-

7,454

$4.390

$4.280

$4.258

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Ampacity Inc.

Singapore . 7,156 parts In-Stock

1+ parts

$4.390

100+ parts

-

1k+ parts

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10k+ parts

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7,156

$4.390

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Corphita

USA . 2,577 parts In-Stock

1+ parts

$4.648

100+ parts

-

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10k+ parts

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2,577

$4.648

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A-Z Elektronik GmbH

Germany . 3,690 parts In-Stock

1+ parts

-

100+ parts

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3,690

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-

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Lixinc

USA . 2,148 parts In-Stock

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2,148

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iodParts Technologies Inc.

India . 1,407 parts In-Stock

1+ parts

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1,407

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Overview

Upgrade your consumer electronics with the TMDS181RGZR by Texas Instruments. With a commitment to quality and innovation, Texas Instruments delivers cutting-edge solutions for consumer ICs. This versatile chip carrier offers a wide range of applications, from audio/video systems to smart home devices. Experience the value of reliability, efficiency, and performance that the TMDS181RGZR brings to your products. Trust Texas Instruments to elevate your technology to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly.

No. of Functions: 1

With a single function, this product is straightforward and easy to use.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB.

General IC Type: CONSUMER CIRCUIT

This consumer circuit type is versatile and can be used in a variety of consumer electronic applications.

No. of Terminals: 48

With 48 terminals, this product can accommodate a wide range of connections.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety of package styles makes this product adaptable to different design requirements.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in colder environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position offers ease of connection and secure mounting.

Maximum Seated Height: 1 mm

The low maximum seated height saves space and allows for compact designs.

Width: 7 mm

The narrow width of 7mm facilitates placement on densely packed PCBs.

Minimum Supply Voltage (Vsup): 1 V

With a low minimum supply voltage, this product is energy efficient.

Maximum Time At Peak Reflow Temperature: 30s

The product can withstand peak reflow temperatures for a sufficient amount of time during assembly.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature ensures proper soldering and reliability.

Length: 7 mm

The short length of 7mm makes this product suitable for compact electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating conditions.

No. of Channels: 4

With 4 channels, this product can handle multiple inputs or outputs effectively.

Terminal Form: NO LEAD

The terminal form without leads simplifies connection and reduces the risk of damage.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates moderate sensitivity to moisture, making proper handling crucial.

Maximum Supply Voltage (Vsup): 1.27 V

The slightly higher maximum supply voltage ensures compatibility with a range of power sources.

Technical Specifications

Other Function Consumer ICs TMDS181RGZR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES AT 3.3V

General IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.27 V

Minimum Supply Voltage (Vsup):

1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TMDS181RGZR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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