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TMDS250PAGRG4

Texas Instruments

TMDS250PAGRG4 by Texas Instruments

TMDS250PAGRG4 by Texas Instruments is a 64-terminal IC with power supplies of 3.3V and 5V, suitable for consumer circuits. It features a max operating temperature of 70°C, GULL WING terminal form, and PLASTIC/EPOXY package material. Ideal for applications requiring a thin profile and fine pitch package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,877 parts In-Stock

1+ parts

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2,877

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Vyrian

USA . 2,804 parts In-Stock

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2,804

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,308 parts In-Stock

1+ parts

$2.498

100+ parts

-

1k+ parts

$2.989

10k+ parts

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2,308

$2.498

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$2.989

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DigiPath Technology Company

USA . 81 parts In-Stock

1+ parts

$2.751

100+ parts

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81

$2.751

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ChromeModa Solutions

Germany . 5,411 parts In-Stock

1+ parts

$2.807

100+ parts

$2.302

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5,411

$2.807

$2.302

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IDEA Electronic Components Group

UK . 616 parts In-Stock

1+ parts

$2.807

100+ parts

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$2.526

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616

$2.807

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$2.526

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One Stop Electronics

USA . 301 parts In-Stock

1+ parts

$11.800

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301

$11.800

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AZTECH Wire

Italy . 380 parts In-Stock

1+ parts

$14.580

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380

$14.580

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Corphita

USA . 1,870 parts In-Stock

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1,870

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Overview

Unleash the power of cutting-edge technology with the TMDS250PAGRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality in the category of consumer ICs. This versatile product, with its advanced features and innovative design, opens up a world of possibilities for various applications. From enhancing efficiency to improving performance, the TMDS250PAGRG4 offers exceptional value and benefits to customers seeking reliable solutions. Experience the advantage of top-notch engineering and elevate your projects to new heights with this outstanding product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it suitable for consumer electronics.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient assembly onto circuit boards, saving time and cost in production.

Package Shape: SQUARE

The square package shape helps in efficient use of board space and facilitates neat and organized circuit layouts.

Power Supplies (V): 3.3,5

Support for multiple power supply options (3.3V and 5V) allows for flexibility in design and compatibility with a wide range of electronic devices.

No. of Terminals: 64

Having a high number of terminals (64) enables the product to connect to various components, enhancing its functionality and versatility.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style ensures efficient heat dissipation, space-saving design, and compatibility with modern circuit board layouts.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures the product can handle demanding operating conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C guarantees reliable performance even in cold environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and durability for long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, reducing the risk of disconnections and ensuring consistent performance.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm enables the product to be used in compact electronic devices without adding extra bulk.

Width: 10 mm

The moderate width of 10mm strikes a balance between space efficiency and ease of handling during assembly and maintenance.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement of 3V ensures compatibility with a wide range of power sources commonly used in consumer electronics.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 30 seconds ensures proper soldering and prevents damage to the product during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable and robust soldering connections that can withstand harsh operating conditions.

Length: 10 mm

The compact length of 10mm contributes to the overall small form factor of the product, making it ideal for space-constrained electronic devices.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the product is suitable for use in standard consumer electronic applications, offering reliable performance in typical operating environments.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and thermal dissipation, enhancing the product's durability and reliability in challenging conditions.

Maximum Supply Current: 200 mA

With a maximum supply current of 200mA, the product can efficiently power various components, making it a versatile choice for diverse consumer electronics.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting of components on circuit boards, optimizing space and facilitating intricate designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product has a moderate level of sensitivity to moisture, suitable for standard handling and storage practices.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V ensures stable operation within safe voltage limits, protecting the product and connected components from potential damage.

Technical Specifications

Other Function Consumer ICs TMDS250PAGRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO IT REQUIRES 4.5V TO 5.5V SUPPLY

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

200 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TMDS250PAGRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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