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TMDS261PAG

Texas Instruments

TMDS261PAG by Texas Instruments

TMDS261PAG by Texas Instruments is a consumer IC with 64 terminals in a square package. It operates b/w 0-70°C, with Vsup ranging from 3-3.6V. Ideal for applications requiring fine pitch and thin profile flatpacks.

Median Price

$1.938

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$1.730

1k+ parts

$1.550

10k+ parts

$1.460

800

-

$1.730

$1.550

$1.460

DigiKey

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.000

10k+ parts

-

800

-

-

$2.000

-

Verical

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.938

10k+ parts

$1.825

800

-

-

$1.938

$1.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,590 parts In-Stock

1+ parts

$1.824

100+ parts

-

1k+ parts

-

10k+ parts

-

1,590

$1.824

-

-

-

Vyrian

USA . 6,968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,968

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 44 parts In-Stock

1+ parts

$1.315

100+ parts

$122.074

1k+ parts

$1.183

10k+ parts

-

44

$1.315

$122.074

$1.183

-

DigiPath Technology Company

USA . 2,088 parts In-Stock

1+ parts

$1.447

100+ parts

$1.332

1k+ parts

-

10k+ parts

-

2,088

$1.447

$1.332

-

-

IDEA Electronic Components Group

UK . 1,389 parts In-Stock

1+ parts

$1.477

100+ parts

-

1k+ parts

$1.329

10k+ parts

-

1,389

$1.477

-

$1.329

-

ChromeModa Solutions

Germany . 180 parts In-Stock

1+ parts

$1.477

100+ parts

$1.211

1k+ parts

-

10k+ parts

-

180

$1.477

$1.211

-

-

Corphita

USA . 461 parts In-Stock

1+ parts

$1.728

100+ parts

-

1k+ parts

-

10k+ parts

-

461

$1.728

-

-

-

A-Z Elektronik GmbH

Germany . 6,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,479

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Microchip USA

USA . 194 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

194

-

-

-

-

Overview

Elevate your consumer electronics with the TMDS261PAG by Texas Instruments. With a reputation for excellence in manufacturing, this innovative consumer circuit offers unmatched quality and reliability. Whether you're designing cutting-edge wearables, smart home devices, or automotive applications, this IC delivers exceptional performance and efficiency. Experience the value of seamless integration, high-speed data transmission, and enhanced functionality that only Texas Instruments can provide. Upgrade your products with TMDS261PAG and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards, saving time and effort in assembly.

Package Shape: SQUARE

Square shape makes the IC easy to handle and provides a compact form factor for space-saving designs.

Maximum Operating Temperature: 70 °C

This high operating temperature range ensures reliable performance even in demanding environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term durability.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement allows for energy-efficient operation.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates that the IC has moderate moisture sensitivity, suitable for standard manufacturing processes.

Technical Specifications

Other Function Consumer ICs TMDS261PAG attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TMDS261PAG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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