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FM31276-GTR

Infineon Technologies

FM31276-GTR by Infineon Technologies

FM31276-GTR by Infineon Technologies is a consumer IC with 14 terminals in a small outline package. It operates b/w -40 to 85°C, with supply voltage ranging from 4V to 5.5V. This rectangular IC, suitable for industrial use, features gull wing terminals and pure tin finish, making it ideal for various consumer circuit applications.

Median Price

$5.560

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 17,500 parts In-Stock

1+ parts

-

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$5.560

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17,500

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$5.560

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Flip Electronics (Authorized)

USA . 17,500 parts In-Stock

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17,500

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Rochester

USA . 2,500 parts In-Stock

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$5.000

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$4.470

10k+ parts

$4.210

2,500

-

$5.000

$4.470

$4.210

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$6.250

1k+ parts

$5.588

10k+ parts

$5.263

2,500

-

$6.250

$5.588

$5.263

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 21,980 parts In-Stock

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Vyrian

USA . 17,274 parts In-Stock

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Digiode

USA . 941 parts In-Stock

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941

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 4,468 parts In-Stock

1+ parts

$1.215

100+ parts

$1.166

1k+ parts

$1.118

10k+ parts

-

4,468

$1.215

$1.166

$1.118

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Corohmni

South Africa . 287 parts In-Stock

1+ parts

$1.682

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287

$1.682

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Aztec Data Supply Inc.

USA . 1,046 parts In-Stock

1+ parts

$1.774

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1,046

$1.774

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Ampacity Inc.

Singapore . 17,043 parts In-Stock

1+ parts

$4.730

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17,043

$4.730

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Microchip USA

USA . 7,104 parts In-Stock

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$19.600

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7,104

$19.600

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QUARKTWIN TECHNOLOGY LTD

USA . 8,506 parts In-Stock

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8,506

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Continental Prestige Electronics

USA . 6,117 parts In-Stock

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6,117

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Argo Parts USA

USA . 3,616 parts In-Stock

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3,616

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Bastille Electronics

Australia . 600 parts In-Stock

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600

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Corphita

USA . 519 parts In-Stock

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519

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Perfect Parts

USA . 111 parts In-Stock

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111

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Overview

Experience the next level of performance and reliability with the FM31276-GTR by Infineon Technologies. With a reputation for excellence in manufacturing, this product is designed to meet the highest standards of quality and durability. Ideal for a wide range of applications, this consumer circuit offers unparalleled value and benefits to customers looking for a versatile and dependable solution. Trust Infineon Technologies to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

The surface mount technology allows for easy installation and space-saving on PCBs.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard PCB designs and layouts.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage rating allows for flexibility in power supply options.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range ensures functionality in extreme environments.

Technical Specifications

Other Function Consumer ICs FM31276-GTR attributes and parameters. Explore more Other Function Consumer ICs devices from Infineon Technologies

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.6483 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.727 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

FM31276-GTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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