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FM31276-G

Infineon Technologies

FM31276-G by Infineon Technologies

FM31276-G by Infineon Technologies is a consumer IC with 14 terminals in a small outline package. It operates b/w -40 to 85°C, with supply voltage ranging from 4V to 5.5V. Ideal for industrial applications requiring a compact rectangular design and surface mount capability.

Median Price

$7.770

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 72 parts In-Stock

1+ parts

$6.138

100+ parts

$5.564

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-

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72

$6.138

$5.564

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Mouser Electronics

USA . 558 parts In-Stock

1+ parts

$9.290

100+ parts

$7.530

1k+ parts

$6.830

10k+ parts

$6.110

558

$9.290

$7.530

$6.830

$6.110

DigiKey

USA . 59 parts In-Stock

1+ parts

$9.290

100+ parts

$8.147

1k+ parts

$7.527

10k+ parts

$7.336

59

$9.290

$8.147

$7.527

$7.336

Chip1Stop

Japan . 88 parts In-Stock

1+ parts

$12.600

100+ parts

$6.910

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-

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88

$12.600

$6.910

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Flip Electronics (Authorized)

USA . 17,500 parts In-Stock

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17,500

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Rochester

USA . 1,284 parts In-Stock

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$5.000

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$4.470

10k+ parts

$4.210

1,284

-

$5.000

$4.470

$4.210

Verical

USA . 781 parts In-Stock

1+ parts

-

100+ parts

$6.250

1k+ parts

$5.588

10k+ parts

$5.263

781

-

$6.250

$5.588

$5.263

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 141 parts In-Stock

1+ parts

$5.282

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-

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141

$5.282

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Bristol Electronics

USA . 56 parts In-Stock

1+ parts

$10.107

100+ parts

$4.379

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-

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56

$10.107

$4.379

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Flip Electronics

USA . 21,980 parts In-Stock

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Vyrian

USA . 2,456 parts In-Stock

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2,456

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Euro-Tech

UK . 173 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 56 parts In-Stock

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56

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Dan-Mar Components

USA . 56 parts In-Stock

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56

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Nova Conductors

Japan . 17 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 691 parts In-Stock

1+ parts

$1.533

100+ parts

-

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691

$1.533

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Aztec Data Supply Inc.

USA . 2,620 parts In-Stock

1+ parts

$2.683

100+ parts

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2,620

$2.683

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Modulus Dynamics

Lithuania . 1,322 parts In-Stock

1+ parts

$3.949

100+ parts

$3.791

1k+ parts

$3.633

10k+ parts

-

1,322

$3.949

$3.791

$3.633

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Ampacity Inc.

Singapore . 2,454 parts In-Stock

1+ parts

$4.730

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2,454

$4.730

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Corphita

USA . 169 parts In-Stock

1+ parts

$5.004

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169

$5.004

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QUARKTWIN TECHNOLOGY LTD

USA . 14,804 parts In-Stock

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14,804

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Lixinc

USA . 10,534 parts In-Stock

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10,534

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Kepictronics

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,237 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Continental Prestige Electronics

USA . 2,070 parts In-Stock

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2,070

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Metaverse IC Inc.

Canada . 691 parts In-Stock

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691

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Perfect Parts

USA . 178 parts In-Stock

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178

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Overview

Upgrade your consumer electronic devices with the FM31276-G by Infineon Technologies. With a reputation for excellence in manufacturing quality ICs, Infineon delivers a product that boasts reliability and durability. This versatile IC is suitable for various applications in the consumer electronics industry. Experience the value of seamless integration, improved performance, and enhanced functionality with the FM31276-G. Trust Infineon to elevate your products to the next level of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps protect the internal components of the IC, making it reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on printed circuit boards, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used in consumer electronics, making this IC compatible with various devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand demanding environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the IC can function effectively even in cold environments.

Width: 3.9 mm

Compact width of 3.9mm allows for efficient use of space on the PCB and enables the IC to be used in space-constrained applications.

Minimum Supply Voltage (Vsup): 4 V

Low minimum supply voltage requirement of 4V allows for flexibility in power supply options and compatibility with a wide range of systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm facilitates easy soldering and connection on the PCB, making it suitable for mass production and automated assembly processes.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level of 3 indicates that the IC has a moderate degree of moisture sensitivity, suitable for a variety of manufacturing and storage environments.

Technical Specifications

Other Function Consumer ICs FM31276-G attributes and parameters. Explore more Other Function Consumer ICs devices from Infineon Technologies

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.6483 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.727 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

FM31276-G General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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