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FM31278-GTR

Infineon Technologies

FM31278-GTR by Infineon Technologies

FM31278-GTR by Infineon Technologies is a small outline consumer circuit with 14 terminals. It operates in industrial temperature range (-40 to 85°C) and has a supply voltage of 4-5.5V. This surface mount IC is suitable for various applications requiring a compact and reliable solution.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

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Vyrian

USA . 666 parts In-Stock

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666

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Digiode

USA . 22 parts In-Stock

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22

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 362 parts In-Stock

1+ parts

$2.106

100+ parts

$2.022

1k+ parts

$1.938

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362

$2.106

$2.022

$1.938

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Aztec Data Supply Inc.

USA . 1,993 parts In-Stock

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$3.184

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Corohmni

South Africa . 63 parts In-Stock

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$3.582

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63

$3.582

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AZTECH Wire

Italy . 892 parts In-Stock

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$5.694

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$5.694

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Ampacity Inc.

Singapore . 490 parts In-Stock

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$9.800

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Component Stockers USA

USA . 304 parts In-Stock

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$136.050

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Continental Prestige Electronics

USA . 5,378 parts In-Stock

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Perfect Parts

USA . 3,840 parts In-Stock

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Corphita

USA . 796 parts In-Stock

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Argo Parts USA

USA . 586 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Discover the FM31278-GTR by Infineon Technologies, a high-quality consumer IC that is designed to elevate your electronics experience. With its advanced manufacturing techniques and expertise, Infineon Technologies has created a product that offers unparalleled performance and reliability. This small outline IC is perfect for a wide range of applications, thanks to its versatile features and robust design. Don't miss out on the value and benefits this product brings to your projects. Upgrade your devices today with the FM31278-GTR and experience the difference.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product is made with a durable plastic/epoxy material, ensuring long-lasting performance and protection.

Surface Mount:

YES - Being surface mountable makes this product suitable for compact and space-constrained applications.

No. of Functions:

1 - With a single function, this product simplifies the design and implementation process.

Package Shape:

RECTANGULAR - The rectangular package shape allows for easy integration and placement in various electronic systems.

General IC Type:

CONSUMER CIRCUIT - This IC is specifically designed for consumer circuits, making it an ideal choice for consumer electronic products.

No. of Terminals:

14 - The product's 14 terminals enable connectivity and compatibility with various external devices or components.

Package Style (Meter):

SMALL OUTLINE - The small outline package style offers space-saving advantages, making it suitable for compact designs.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, this product can withstand demanding operating conditions.

Minimum Operating Temperature:

40 °C - The product's low minimum operating temperature ensures reliable performance even in extreme environmental conditions.

Terminal Finish:

PURE TIN - The use of pure tin as the terminal finish provides excellent conductivity and reliability.

Terminal Position:

DUAL - Dual terminal positions offer flexibility in circuit connection, enhancing overall design versatility.

Maximum Seated Height:

1.727 mm - With a low seated height, this product is suitable for applications with height limitations.

Width:

3.9 mm - The narrow width of this product allows for efficient usage of available space.

Minimum Supply Voltage (Vsup):

4 V - The low minimum supply voltage requirement makes this product energy-efficient and compatible with various power sources.

Maximum Time At Peak Reflow Temperature (s):

30 - This product can handle peak reflow temperature for up to 30 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature capability enables reliable soldering for robust connections.

Length:

8.6483 mm - The compact length of this product contributes to its suitability for space-constrained designs.

Temperature Grade:

INDUSTRIAL - Designed for industrial applications, this product can operate under harsh temperature conditions.

Terminal Form:

GULL WING - The gull-wing terminal form allows for easy soldering and secure mechanical connection.

Terminal Pitch:

1.27 mm - The small terminal pitch provides compatibility with standard PCB designs and ease of mounting.

Moisture Sensitivity Level (MSL):

3 - With MSL 3 rating, this product offers enhanced resistance to moisture, ensuring reliable performance under humid conditions.

Maximum Supply Voltage (Vsup):

5.5 V - The high maximum supply voltage capability allows for compatibility with a wide range of power sources.

Technical Specifications

Other Function Consumer ICs FM31278-GTR attributes and parameters. Explore more Other Function Consumer ICs devices from Infineon Technologies

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.6483 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.727 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

FM31278-GTR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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