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LA72912V-TLM-H

Onsemi

LA72912V-TLM-H by Onsemi

LA72912V-TLM-H by Onsemi is a small outline, low profile consumer circuit IC with 24 terminals. It operates b/w -30°C to 70°C and has a min supply voltage of 4.7V. This IC is commonly used in various consumer electronic applications.

Median Price

$2.828

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,870 parts In-Stock

1+ parts

-

100+ parts

$2.670

1k+ parts

$2.390

10k+ parts

$2.250

4,870

-

$2.670

$2.390

$2.250

Verical

USA . 4,710 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.987

10k+ parts

-

4,710

-

-

$2.987

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 27 parts In-Stock

1+ parts

$2.640

100+ parts

-

1k+ parts

-

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-

27

$2.640

-

-

-

Digiode

USA . 761 parts In-Stock

1+ parts

$2.822

100+ parts

-

1k+ parts

-

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761

$2.822

-

-

-

Vyrian

USA . 5,991 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,991

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,922 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

2,922

$1.980

-

-

-

Ampacity Inc.

Singapore . 4,723 parts In-Stock

1+ parts

$2.520

100+ parts

-

1k+ parts

-

10k+ parts

-

4,723

$2.520

-

-

-

Argo Parts USA

USA . 4,756 parts In-Stock

1+ parts

$2.640

100+ parts

-

1k+ parts

-

10k+ parts

-

4,756

$2.640

-

-

-

Continental Prestige Electronics

USA . 2,984 parts In-Stock

1+ parts

$2.640

100+ parts

-

1k+ parts

-

10k+ parts

$2.587

2,984

$2.640

-

-

$2.587

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.640

100+ parts

$2.587

1k+ parts

-

10k+ parts

-

1,000

$2.640

$2.587

-

-

Corphita

USA . 358 parts In-Stock

1+ parts

$2.673

100+ parts

-

1k+ parts

-

10k+ parts

-

358

$2.673

-

-

-

Corohmni

South Africa . 85 parts In-Stock

1+ parts

$2.970

100+ parts

-

1k+ parts

-

10k+ parts

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85

$2.970

-

-

-

Semicontronic

India . 4,656 parts In-Stock

1+ parts

$5.490

100+ parts

$5.353

1k+ parts

$5.325

10k+ parts

-

4,656

$5.490

$5.353

$5.325

-

AZTECH Wire

Italy . 388 parts In-Stock

1+ parts

$12.720

100+ parts

-

1k+ parts

-

10k+ parts

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388

$12.720

-

-

-

Perfect Parts

USA . 13,447 parts In-Stock

1+ parts

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13,447

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-

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Lixinc

USA . 11,286 parts In-Stock

1+ parts

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11,286

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-

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Kepictronics

USA . 8,000 parts In-Stock

1+ parts

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8,000

-

-

-

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SupplyDigital Components

Austria . 5,714 parts In-Stock

1+ parts

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100+ parts

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5,714

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-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

-

TANS Electronics

Latvia . 3,162 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,162

-

-

-

-

Kulean Microsystems

USA . 1,471 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,471

-

-

-

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UHIMA Technologies

Türkiye . 842 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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842

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-

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Problanco Electronics

Mexico . 661 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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661

-

-

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Microchip USA

USA . 238 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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238

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-

Overview

Experience superior quality and performance with the LA72912V-TLM-H by Onsemi, a leading manufacturer in the industry. This product falls under the category of Other Function Consumer ICs, making it versatile for various applications. With its small outline and low profile package style, it offers convenience and ease of use. From its wide operating temperature range to its dual terminal position, this product is designed to exceed expectations. Trust Onsemi to deliver value, benefits, and advantages that cater to your needs. Discover the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product uses a plastic/epoxy package body material, which provides excellent durability and protection for the integrated circuit, making it a reliable choice for consumer applications.

Surface Mount: YES

With surface mount capability, this product can be easily mounted and soldered onto a PCB, simplifying the manufacturing process and allowing for efficient assembly.

No. of Functions: 1

Featuring a single function, this consumer IC provides dedicated functionality, ensuring focused and reliable performance for specific application requirements.

Package Shape: RECTANGULAR

The rectangular package shape allows for compact and space-efficient integration on the circuit board, maximizing the utilization of available area.

General IC Type: CONSUMER CIRCUIT

Designed as a consumer circuit IC, this product is optimized for consumer electronics applications, offering efficient and reliable operation in various consumer devices.

No. of Terminals: 24

Equipped with 24 terminals, this IC provides ample connectivity options, enabling the interconnection with other electronic components and peripherals.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style enhances the overall compactness of the IC, contributing to space-saving and high-density board designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand elevated temperatures without compromising its performance, ensuring stable operation in demanding environments.

Minimum Operating Temperature: -30 °C

The IC's minimum operating temperature of -30°C allows it to perform reliably even in extremely cold conditions, making it suitable for a wide range of environments.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish enhances the solderability and longevity of the IC, providing a robust and reliable electrical connection that contributes to the overall durability and long-term functionality of the product.

Terminal Position: DUAL

With dual terminal positions, this IC allows for flexible PCB layout and versatile integration options, facilitating efficient circuit board design and implementation.

Maximum Seated Height: 1.5 mm

Featuring a compact maximum seated height of 1.5 mm, this IC enables low-profile and space-saving designs, making it suitable for applications where height restrictions are a concern.

Width: 5.6 mm

The IC's width of 5.6 mm ensures a compact footprint, enabling efficient space utilization while accommodating other components or circuitry in the electronic system.

Minimum Supply Voltage (Vsup): 4.7 V

With a minimum supply voltage requirement of 4.7 volts, this IC can operate with a relatively low power source, providing energy efficiency and flexibility in various power supply configurations.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time the IC can withstand at peak reflow temperature without degradation is 30 seconds, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper solder melting and bonding during the manufacturing process, resulting in reliable connections and long-term performance.

Length: 8.02 mm

The IC's length of 8.02 mm contributes to its overall compact size, making it suitable for space-constrained applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and robust connections, ensuring secure attachment to the PCB and facilitating efficient assembly and rework processes.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm enables high-density integration, allowing for closer spacing between terminals and enhancing the IC's overall connectivity capabilities.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this IC has moderate sensitivity to moisture, making it suitable for use in controlled environments with specific moisture management measures.

Maximum Supply Voltage (Vsup): 5.5 V

The IC can safely operate at a maximum supply voltage of 5.5 volts, providing flexibility in power supply configurations and ensuring compatibility with a wide range of operating conditions.

Technical Specifications

Other Function Consumer ICs LA72912V-TLM-H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Length:

8.02 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.6 mm

Trade Compliance

LA72912V-TLM-H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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