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LA72648M

Onsemi

LA72648M by Onsemi

LA72648M by Onsemi is a consumer IC with 80 terminals in a square flatpack package. It features gull wing terminals, 0.65mm pitch, and 3mm seated height. Ideal for various consumer circuit applications requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,168 parts In-Stock

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1,168

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Vyrian

USA . 1,026 parts In-Stock

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1,026

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,714 parts In-Stock

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7,714

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TANS Electronics

Latvia . 5,286 parts In-Stock

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5,286

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Problanco Electronics

Mexico . 4,264 parts In-Stock

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4,264

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Corphita

USA . 2,410 parts In-Stock

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2,410

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Kulean Microsystems

USA . 1,496 parts In-Stock

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1,496

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UHIMA Technologies

Türkiye . 618 parts In-Stock

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618

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Corohmni

South Africa . 77 parts In-Stock

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Overview

Discover the LA72648M by Onsemi, a top-quality consumer IC that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is designed for a wide range of applications, making it a versatile choice for various projects. With its durable plastic/epoxy body material and surface mount capability, the LA72648M stands out as a cost-effective solution that delivers exceptional value to customers. Whether you're looking to enhance your consumer electronics or streamline your circuit design, this product is sure to exceed your expectations. Experience the benefits and advantages of the LA72648M today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount capability makes the product easy to install on circuit boards, reducing assembly time and offering convenience to manufacturers.

Package Shape: SQUARE

The square shape allows for efficient use of space on circuit boards, enabling a compact and streamlined design for electronic devices.

No. of Terminals: 80

With a high number of terminals, this IC can accommodate multiple connections, making it suitable for complex consumer circuits with various input and output requirements.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections, reducing signal interference and enhancing the overall performance of the IC.

Width: 14 mm

The compact width of 14 mm makes this IC suitable for applications where space is limited, ensuring versatility in a wide range of electronic devices.

Length: 14 mm

The matching length of 14 mm with the width allows for a square form factor, further enhancing the product's compatibility with compact electronic designs.

Terminal Form: GULL WING

The gull wing terminal form provides stable and secure connections on circuit boards, minimizing the risk of signal loss or disconnection in demanding consumer applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm ensures precise alignment and spacing of connections, enabling high-density circuit designs with efficient signal transmission.

Technical Specifications

Other Function Consumer ICs LA72648M attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7SQ

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

3 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LA72648M General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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