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LA72715NV

Onsemi

LA72715NV by Onsemi

LA72715NV by Onsemi is a consumer circuit IC with 24 terminals in a small outline package. It operates b/w -20 °C to 80°C, suitable for commercial extended temperature applications. With a supply voltage range of 4.5V to 5.5V, it is ideal for various consumer electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 534 parts In-Stock

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Digiode

USA . 443 parts In-Stock

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443

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Kulean Microsystems

USA . 3,429 parts In-Stock

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3,429

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TANS Electronics

Latvia . 3,093 parts In-Stock

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SupplyDigital Components

Austria . 1,922 parts In-Stock

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Problanco Electronics

Mexico . 1,247 parts In-Stock

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Corphita

USA . 598 parts In-Stock

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UHIMA Technologies

Türkiye . 409 parts In-Stock

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Corohmni

South Africa . 389 parts In-Stock

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Overview

Discover the ultimate solution for your consumer electronic applications with the LA72715NV by Onsemi. This high-quality, small outline IC offers unparalleled performance and reliability, thanks to Onsemi's reputation for excellence in manufacturing. Whether you're looking to enhance the functionality of your devices or improve overall efficiency, this product delivers on all fronts. Upgrade your electronics today with the LA72715NV and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, reducing production time and costs.

Package Shape: RECTANGULAR

Rectangular shape offers compatibility with standard PCB layouts, facilitating integration into existing designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliable performance in everyday electronic devices.

No. of Terminals: 24

Sufficient number of terminals for connectivity and functionality, supporting complex circuit configurations.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact and low-profile package style saves space on the PCB, ideal for size-constrained applications.

Maximum Operating Temperature: 80 °C

High maximum operating temperature range allows the IC to function reliably in varying thermal environments.

Minimum Operating Temperature: -20 °C

Wide temperature range ensures operational stability even in cold conditions, enhancing versatility.

Terminal Position: DUAL

Dual terminal position provides flexibility for different PCB layouts and simplifies installation.

Maximum Seated Height: 1.5 mm

Low seated height minimizes board space requirements and enables compact designs.

Width: 5.6 mm

Narrow width contributes to space-saving on the PCB and allows for efficient component placement.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage enables operation in low-power scenarios, enhancing energy efficiency.

Length: 7.8 mm

Optimal length for balancing size constraints with functionality, offering a compact yet versatile package.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures performance reliability across various operating environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure electrical connections and ease of soldering during assembly.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting, enabling intricate circuit designs in limited spaces.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance offers robustness against voltage fluctuations, enhancing reliability.

Technical Specifications

Other Function Consumer ICs LA72715NV attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.6 mm

Trade Compliance

LA72715NV General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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