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LA72730

Onsemi

LA72730 by Onsemi

LA72730 by Onsemi is a consumer circuit IC with 24 terminals in an in-line package. It operates b/w -20 °C to 70°C, with supply voltage ranging from 4.5V to 5.5V. This rectangular IC is commonly used in various consumer electronic applications for its compact size and versatile functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,019 parts In-Stock

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2,019

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Vyrian

USA . 1,742 parts In-Stock

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1,742

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 7,125 parts In-Stock

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7,125

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Problanco Electronics

Mexico . 6,721 parts In-Stock

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6,721

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SupplyDigital Components

Austria . 5,800 parts In-Stock

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5,800

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Corphita

USA . 1,952 parts In-Stock

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1,952

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Kulean Microsystems

USA . 1,751 parts In-Stock

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1,751

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UHIMA Technologies

Türkiye . 510 parts In-Stock

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510

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Corohmni

South Africa . 357 parts In-Stock

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357

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Overview

Experience top-notch quality and reliability with the LA72730 by Onsemi, a leading manufacturer in the industry. This consumer IC offers unparalleled performance and versatility, making it ideal for a wide range of applications. From household appliances to automotive electronics, this product delivers exceptional value and benefits to our customers. Trust Onsemi to provide innovative solutions that meet your needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product lightweight and durable, perfect for consumer electronic applications.

Package Shape: RECTANGULAR

The RECTANGULAR shape allows for easy integration into circuit boards and compact electronic devices.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC, this product is designed to meet the specific needs of consumer electronics, ensuring optimal performance.

No. of Terminals: 24

The 24 terminals provide ample connectivity options for various inputs and outputs, making this product versatile for different applications.

Package Style (Meter): IN-LINE

The IN-LINE package style allows for easy installation and placement within a circuit, contributing to more streamlined design and layout.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, this product can withstand demanding operating conditions without compromising performance.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C ensures that the product can function reliably in various environmental conditions.

Terminal Position: DUAL

The DUAL terminal position provides redundancy and stability in connections, enhancing the overall reliability of the product.

Maximum Seated Height: 3.9 mm

The low maximum seated height of 3.9 mm allows for compact and slim designs, ideal for space-constrained applications.

Width: 7.62 mm

The slim width of 7.62 mm enables the product to be easily integrated into electronic devices with limited space available.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement of 4.5 V enhances energy efficiency and reduces power consumption in applications.

Length: 21 mm

The moderate length of 21 mm provides a balance between compactness and functionality, making it suitable for various electronic designs.

Terminal Form: THROUGH-HOLE

The THROUGH-HOLE terminal form ensures secure and stable connections to the circuit board, preventing accidental disconnections.

Terminal Pitch: 1.78 mm

The small terminal pitch of 1.78 mm allows for dense packing of terminals on the circuit board, maximizing connectivity in a limited space.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources, enhancing the product's versatility.

Technical Specifications

Other Function Consumer ICs LA72730 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

21 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

3.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LA72730 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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