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LA72702NV

Onsemi

LA72702NV by Onsemi

LA72702NV by Onsemi is a consumer circuit IC with 24 terminals in a small outline package. It operates b/w -20 °C to 85°C, suitable for various consumer electronic applications. With a supply voltage range of 4.5V to 5.5V, it offers versatile functionality in compact dimensions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,642 parts In-Stock

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1,642

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Vyrian

USA . 638 parts In-Stock

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638

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 4,542 parts In-Stock

1+ parts

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4,542

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SupplyDigital Components

Austria . 3,426 parts In-Stock

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3,426

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Problanco Electronics

Mexico . 1,808 parts In-Stock

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1,808

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Corphita

USA . 1,677 parts In-Stock

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1,677

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TANS Electronics

Latvia . 1,609 parts In-Stock

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1,609

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UHIMA Technologies

Türkiye . 846 parts In-Stock

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846

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Corohmni

South Africa . 281 parts In-Stock

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281

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Overview

Upgrade your consumer electronics with the high-quality LA72702NV by Onsemi. This versatile IC is perfect for a wide range of applications, providing reliable performance and efficiency. With Onsemi's reputation for excellence in manufacturing, you can trust that this product will deliver exceptional results. Say goodbye to outdated technology and hello to a new level of convenience and functionality with the LA72702NV. Experience the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to heat, making the product suitable for various operating conditions.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on circuit boards, saving space and facilitating mass production.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and efficient placement within electronic devices, optimizing space usage.

No. of Terminals: 24

Having 24 terminals provides flexibility in connecting to other components and peripherals, enhancing the product's functionality.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding and hot environments.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures the product can function effectively in cold conditions as well.

Width: 5.6 mm

Compact width allows for efficient placement on circuit boards, especially in space-constrained designs.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement enables the product to operate with a wide range of power sources, enhancing versatility.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, reducing the risk of disconnection or signal loss.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage ensures compatibility with various power sources, enhancing the product's usability.

Technical Specifications

Other Function Consumer ICs LA72702NV attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.6 mm

Trade Compliance

LA72702NV General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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