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LA72702NV-TLM-E

Onsemi

LA72702NV-TLM-E by Onsemi

LA72702NV-TLM-E by Onsemi is a 24-terminal IC with 5V power supply, operating b/w -20 °C to 85°C. It features GULL WING terminals, PLASTIC/EPOXY body material, and is surface mountable. Ideal for consumer circuits in various applications due to its small outline package style.

Median Price

$1.475

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.180

10k+ parts

$1.110

54,000

-

$1.320

$1.180

$1.110

DigiKey

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.740

10k+ parts

-

54,000

-

-

$1.740

-

Verical

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.475

10k+ parts

$1.387

54,000

-

-

$1.475

$1.387

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,147 parts In-Stock

1+ parts

$1.370

100+ parts

-

1k+ parts

-

10k+ parts

-

1,147

$1.370

-

-

-

Digiode

USA . 1,029 parts In-Stock

1+ parts

$1.387

100+ parts

-

1k+ parts

-

10k+ parts

-

1,029

$1.387

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 913 parts In-Stock

1+ parts

$1.314

100+ parts

-

1k+ parts

-

10k+ parts

-

913

$1.314

-

-

-

Corohmni

South Africa . 70 parts In-Stock

1+ parts

$1.370

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$1.370

-

-

-

Continental Prestige Electronics

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

$1.250

1k+ parts

-

10k+ parts

-

54,000

-

$1.250

-

-

Kulean Microsystems

USA . 7,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,976

-

-

-

-

Problanco Electronics

Mexico . 7,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,745

-

-

-

-

SupplyDigital Components

Austria . 5,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,405

-

-

-

-

TANS Electronics

Latvia . 4,858 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,858

-

-

-

-

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Assy Fe

Spain . 1,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,104

-

-

-

-

UHIMA Technologies

Türkiye . 854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

854

-

-

-

-

Overview

Elevate your consumer electronics with the LA72702NV-TLM-E by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge solutions that exceed industry standards. This versatile IC offers a wide range of applications in various electronic devices, providing unmatched performance and efficiency. With a focus on innovation and customer satisfaction, Onsemi ensures that every product delivers exceptional value and benefits to users. Upgrade your technology with the LA72702NV-TLM-E and experience the difference that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, making it ideal for consumer applications where portability and reliability are essential.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly processes, reducing production time and costs.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of power sources and systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand demanding environmental conditions without compromising performance.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this product is less sensitive to moisture, ensuring reliability in humid or damp environments.

Technical Specifications

Other Function Consumer ICs LA72702NV-TLM-E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

50 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LA72702NV-TLM-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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