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LA7217

Onsemi

LA7217 by Onsemi

LA7217 by Onsemi is a 14-terminal IC with a power supply of 5V, operating b/w -15 °C to 65°C. It utilizes bipolar technology and has a max supply current of 9.1mA. This IC is commonly used in consumer electronics for various functions due to its commercial temperature grade and through-hole terminal form.

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Digiode

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Pegasus Components GmbH

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Corel Iberica Componentes, S.L.

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ACDS - Activité Composants Distribution Service

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Prism Electronics

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LittleDiode

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Huijzer Components

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TANS Electronics

Latvia . 8,342 parts In-Stock

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Problanco Electronics

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GreenTree Electronics

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Kulean Microsystems

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Kepictronics

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SupplyDigital Components

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Overview

Elevate your consumer electronic designs with the LA7217 by Onsemi, a high-quality IC that offers unmatched reliability and performance. Designed for various applications in the consumer electronics industry, this innovative product delivers exceptional value and benefits to customers. Experience seamless integration and enhanced functionality with the LA7217, setting new standards for efficiency and convenience in your electronic projects. Partner with Onsemi and unlock the power of cutting-edge technology with the LA7217.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection, making the product suitable for various environments.

Power Supplies (V): 5

Operating at a standard 5V power supply makes the product compatible with many electronic systems.

No. of Terminals: 14

Having a higher number of terminals allows for more connectivity options and versatility in circuit design.

Maximum Operating Temperature: 65 °C

With a maximum operating temperature of 65 °C, the product can withstand high temperature environments without compromising performance.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low power consumption, making the product efficient and reliable.

Technical Specifications

Other Function Consumer ICs LA7217 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-15 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

9.1 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

LA7217 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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