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LA72703V

Onsemi

LA72703V by Onsemi

LA72703V by Onsemi is a consumer circuit IC with 24 terminals in a small outline package. It operates b/w -20 °C to 85°C, suitable for various applications. With a supply voltage range of 4.5V to 5.5V, it is ideal for compact electronic devices requiring precise control and processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,623 parts In-Stock

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1,623

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Vyrian

USA . 1,045 parts In-Stock

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1,045

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,849 parts In-Stock

1+ parts

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7,849

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Problanco Electronics

Mexico . 6,383 parts In-Stock

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6,383

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TANS Electronics

Latvia . 5,840 parts In-Stock

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5,840

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Kulean Microsystems

USA . 4,220 parts In-Stock

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4,220

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Corphita

USA . 2,288 parts In-Stock

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2,288

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Corohmni

South Africa . 133 parts In-Stock

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133

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UHIMA Technologies

Türkiye . 48 parts In-Stock

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48

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Overview

Discover the cutting-edge LA72703V by Onsemi, a high-quality consumer IC that guarantees top-notch performance and reliability. Manufactured by industry leader Onsemi, this product is designed to meet the demands of various applications in the consumer electronics sector. With its compact design and advanced features, the LA72703V offers unparalleled value and benefits to customers looking for superior functionality and efficiency. Upgrade your electronic devices with the LA72703V and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability makes installation and assembly easier, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards, maximizing the number of components that can be installed.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes this product suitable for use in a wide range of environments, even those with higher temperatures.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for operation in colder environments without risking damage to the product.

Terminal Position: DUAL

Dual terminal position provides flexibility in the way the product can be connected to other components, allowing for various configurations.

Width: 5.6 mm

Compact width makes this product suitable for applications where space is limited, without compromising on performance.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement allows for efficient power usage and compatibility with a wide range of power sources.

Terminal Form: GULL WING

Gull wing terminal form ensures secure connections with other components, reducing the risk of loose connections or intermittent faults.

Technical Specifications

Other Function Consumer ICs LA72703V attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.6 mm

Trade Compliance

LA72703V General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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