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INMP441ACEZ-R7

Invensense

INMP441ACEZ-R7 by Invensense

INMP441ACEZ-R7 by Invensense is a consumer IC with power supplies of 1.8/3.3V, operating temperature range of -40 to 85°C, and peak reflow temperature of 260°C. This PLASTIC/EPOXY package is surface mountable and suitable for industrial applications requiring high-performance audio sensing in compact designs.

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LIBRA Elektronik GmbH

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AZTECH Wire

Italy . 332 parts In-Stock

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Metaverse IC Inc.

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Futuretech Components

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Unlock the potential of your consumer electronics with the INMP441ACEZ-R7 by Invensense. Designed with precision and quality in mind, this cutting-edge consumer circuit is sure to exceed your expectations. Whether you're looking to enhance the audio capabilities of your devices or improve their overall functionality, this innovative product offers unparalleled value and performance. Trust in Invensense's reputation for excellence and take your projects to the next level with the INMP441ACEZ-R7.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable housing for the IC, making it ideal for consumer electronics.

Surface Mount: YES

The surface mount design allows for easy and efficient installation, saving time and effort during assembly.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, ensuring optimal performance and compatibility with various devices.

Power Supplies (V): 1.8/3.3

Supports multiple power supply voltages, offering flexibility and compatibility with different systems.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact design, saving space and improving overall circuit density.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and deliver reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures operation in a wide range of environments, from extreme cold to hot conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and connections, enhancing ease of use and installation.

Maximum Time At Peak Reflow Temperature (s): 30

This quick reflow time ensures efficient soldering and assembly processes, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure solder joints and reliable connections for long-term use.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this IC is built to withstand tough conditions and deliver consistent performance.

Terminal Form: NO LEAD

The no lead terminal form complies with environmental regulations and offers a lead-free option for eco-conscious consumers.

Technical Specifications

Other Function Consumer ICs INMP441ACEZ-R7 attributes and parameters. Explore more Other Function Consumer ICs devices from Invensense

Specs

General IC Type:

Moisture Sensitivity Level (MSL):

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Equivalence Code:

LGA(UNSPEC)

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

INMP441ACEZ-R7 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Invensense

InvenSense, a TDK Group Company, is a world leading provider of MEMS sensor platforms found in Mobile, Wearables, Smart Home, Industrial, and Automotive products. The company’s patented Fabrication Platform, MotionFusion® technology, audio solutions, and location software and services addresses the emerging need of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- sound-, and ultrasonic 3D- based interfaces. In May of 2017, InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation. TDK currently focuses on three market segments: automotive, industrial equipment & energy, and information & communications technology (ICT). As part of its strategy for growth in these key areas, TDK has identified sensors and actuators, energy units and next-generation electronic components as three product areas for strategic growth aimed at unlocking new business opportunities in the sphere of the Internet of Things (IoT). Sensors are viewed as an important IoT-enabling technology, and sensor products and the technology portfolio of TDK will expand dramatically as a result of its acquisition of InvenSense. MotionTracking solutions are rapidly becoming key functions in every consumer electronics device as it provides a more intuitive way for consumers to interact with their electronic devices by tracking their motions in free space and delivering these motions as input commands. Audio is similarly becoming complementary to motion as a means for interacting with contextually aware devices and applications. InvenSense’s vision is to be the leading provider of sensor Systems on Chips (SoC) platform solutions providing an ‘AlwaysOn’ solution by enabling the most seamless sensing experience at the lowest power. InvenSense’s microphone portfolio builds on a strong heritage of industry firsts, including continuous improvement of MEMS microphone SNR, ever-higher integration levels, and even lower power consumption. InvenSense combines the capability to sense audio along with cutting-edge motion detection, which is important for many contextual awareness applications. InvenSense’s MotionTracking portfolio of products and services accurately tracks complex user motions, requiring the use of motion sensors such as gyroscopes, accelerometers, compasses, and pressure sensors, properly calibrating the data, and then fusing the sensor outputs into a single and accurate data stream for use by motion applications. InvenSense delivers turn-key solutions with fully integrated MotionTracking devices, robust MotionFusion algorithms, and in-use calibration firmware. The company’s patented fabrication process is the key technology which enables direct integration of MEMS mechanical structures with CMOS electronics at the wafer level. InvenSense MotionTracking technology is comprised of five core proprietary elements: the Fabrication process, advanced MEMS motion sensor designs, application specific mixed-signal circuitry for sensor signal processing, MotionFusion algorithms and calibration firmware that intelligently assimilates data from multiple sensors for use by end applications, and the MotionApps™ platform of drivers and application programming interfaces (APIs). Although all five elements are critical to providing a complete MotionProcessing solution, the patented Fabrication platform is the core differentiating technology. As a result of our modular and scalable platform architecture, our current and planned products span increasing levels of integration, from standalone single-chip gyroscopes to fully integrated sensor system on chip (SoC) MotionTracking solutions. Founded in 2003, InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy.

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