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LA72670BM

Onsemi

LA72670BM by Onsemi

LA72670BM by Onsemi is a consumer IC with 80 terminals in a square flatpack package. It operates b/w -10 °C to 70°C, with power supplies of 5V and 9V. Ideal for consumer circuit applications requiring a compact design and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,414 parts In-Stock

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2,414

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Vyrian

USA . 1,075 parts In-Stock

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1,075

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 5,768 parts In-Stock

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5,768

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TANS Electronics

Latvia . 5,074 parts In-Stock

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5,074

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Kulean Microsystems

USA . 3,338 parts In-Stock

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3,338

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Corphita

USA . 560 parts In-Stock

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560

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SupplyDigital Components

Austria . 530 parts In-Stock

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530

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UHIMA Technologies

Türkiye . 437 parts In-Stock

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437

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Corohmni

South Africa . 126 parts In-Stock

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Overview

Elevate your consumer electronics with the LA72670BM from Onsemi. With a commitment to quality and innovation, Onsemi has crafted a versatile solution for a wide range of applications in the consumer circuit category. This powerful IC offers unparalleled value, delivering reliable performance and efficiency while maintaining a compact design. Say goodbye to technical hassles and hello to seamless integration with the LA72670BM - the key to taking your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring longevity and reliability in various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto printed circuit boards, saving space and simplifying assembly processes.

Power Supplies (V): 5,9

Support for power supplies at 5V and 9V offers versatility and flexibility in powering the IC, enabling compatibility with different systems and environments.

Package Style (Meter): FLATPACK

Flatpack package style enhances thermal performance and allows for efficient heat dissipation, contributing to overall IC reliability and performance.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement enables operation in systems with limited power availability, increasing the product's adaptability and usability.

Technical Specifications

Other Function Consumer ICs LA72670BM attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 4.8 TO 5.3V AND 8.5 TO 9.5V

General IC Type:

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.68SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5,9

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

115 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LA72670BM General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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