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LA72715V

Onsemi

LA72715V by Onsemi

LA72715V by Onsemi is a 24-terminal consumer IC with a power supply of 5V. It operates b/w -20 °C to 80°C and has a small outline package style. Ideal for consumer circuit applications requiring low profile components.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 411 parts In-Stock

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Vyrian

USA . 174 parts In-Stock

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174

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Problanco Electronics

Mexico . 7,806 parts In-Stock

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TANS Electronics

Latvia . 5,354 parts In-Stock

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Kulean Microsystems

USA . 5,251 parts In-Stock

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SupplyDigital Components

Austria . 4,256 parts In-Stock

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Corphita

USA . 1,745 parts In-Stock

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UHIMA Technologies

Türkiye . 657 parts In-Stock

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Corohmni

South Africa . 214 parts In-Stock

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Overview

Unlock endless possibilities with the LA72715V by Onsemi. Crafted with precision and quality, this innovative consumer IC offers unparalleled performance and reliability. From audio systems to electronic gadgets, this versatile product is designed to elevate your projects to new heights. Experience seamless integration and unmatched efficiency with the LA72715V, a game-changer in the world of consumer electronics. Elevate your creations today with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package lightweight and durable, ensuring reliable performance and easy handling.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to place and secure the IC within electronic devices, optimizing space utilization.

Power Supplies (V): 5

Operating at 5 volts provides a standard power supply requirement that is commonly used in many electronic systems.

No. of Terminals: 24

Having 24 terminals allows for greater connectivity options, enabling the IC to interface with various components within a system.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature of 80 °C, the IC can withstand extended use in various environments.

Minimum Operating Temperature: -20 °C

A low minimum operating temperature of -20 °C ensures the IC can function reliably in colder conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connection, allowing for different wiring configurations.

Width: 5.6 mm

Compact width of 5.6 mm enables the IC to fit easily into tight spaces and layout designs.

Minimum Supply Voltage (Vsup): 4.5 V

Having a minimum supply voltage of 4.5 volts ensures stable operation under varying power conditions.

Length: 7.8 mm

The length of 7.8 mm provides a compact form factor, making it suitable for smaller electronic devices.

Terminal Pitch: 0.65 mm

A narrow terminal pitch of 0.65 mm allows for high-density mounting and efficient use of board space.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a maximum supply voltage of 5.5 volts ensures the IC is protected from overvoltage scenarios.

Technical Specifications

Other Function Consumer ICs LA72715V attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.6 mm

Trade Compliance

LA72715V General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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