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LA72700V

Onsemi

LA72700V by Onsemi

LA72700V by Onsemi is a 36-terminal consumer IC with power supplies of 9V. It operates b/w -10 to 70 °C, suitable for commercial applications. With a small outline package and bipolar technology, it's ideal for various consumer circuit designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 641 parts In-Stock

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641

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Vyrian

USA . 473 parts In-Stock

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473

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Problanco Electronics

Mexico . 8,011 parts In-Stock

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8,011

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TANS Electronics

Latvia . 6,450 parts In-Stock

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6,450

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SupplyDigital Components

Austria . 3,662 parts In-Stock

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Kulean Microsystems

USA . 2,863 parts In-Stock

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Corphita

USA . 1,796 parts In-Stock

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UHIMA Technologies

Türkiye . 742 parts In-Stock

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742

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Corohmni

South Africa . 288 parts In-Stock

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Overview

Enhance your consumer electronics with the LA72700V by Onsemi, a top-quality product designed to elevate your devices to the next level. Manufactured by industry leader Onsemi, this versatile IC offers unparalleled performance and reliability. Perfect for a wide range of applications in the consumer electronics sector, this product provides exceptional value, benefits, and advantages to customers looking for cutting-edge technology. Upgrade your products today with the LA72700V and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and insulation for the components inside, ensuring durability and reliability.

Surface Mount: YES

Enables easy installation and maintenance on circuit boards, saving time and effort.

Power Supplies (V): 9

Provides a stable and sufficient power source to ensure proper functioning of the IC.

Maximum Operating Temperature: 70 °C

Can operate efficiently in a wide range of temperature conditions, making it versatile for various environments.

Width: 5.6 mm

Compact size allows for space-saving integration in electronic devices.

Technical Specifications

Other Function Consumer ICs LA72700V attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

Length:

15 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36,.3,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

9.5 V

Minimum Supply Voltage (Vsup):

8.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

5.6 mm

Trade Compliance

LA72700V General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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