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MC1496D

Onsemi

MC1496D by Onsemi

MC1496D by Onsemi is a 14-terminal IC with small outline package. It operates b/w 0-70°C, suitable for consumer circuits. With peak reflow temp of 235°C, it's ideal for surface mount applications in various electronic devices.

Median Price

$5.891

Lifecycle Status

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Ace Electronics

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J2 Sourcing AB

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Holdelec - ElecDif-Pro

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ECAB

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Mil-Aero Solutions, Inc.

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Component Sense

UK . 28 parts In-Stock

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Corel Iberica Componentes, S.L.

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Resion

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Benley Electronics

USA . 1 parts In-Stock

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Corohmni

South Africa . 285 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,453 parts In-Stock

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AZTECH Wire

Italy . 815 parts In-Stock

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Ampacity Inc.

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Semicontronic

India . 507 parts In-Stock

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TANS Electronics

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Problanco Electronics

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Cyclops Electronics Ltd (Excess)

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UHIMA Technologies

Türkiye . 360 parts In-Stock

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Glotronic Ltd.

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Overview

Experience the cutting-edge technology of Onsemi with the MC1496D. This high-quality consumer IC is designed to meet all your needs with precision and reliability. With a wide range of applications, this product offers unparalleled value and benefits to customers looking for top-of-the-line performance. Trust Onsemi to deliver excellence in every aspect, from package body material to terminal finish. Upgrade your circuits today with the MC1496D and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and lightweight, ideal for consumer applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost.

No. of Terminals: 14

With 14 terminals, this IC can accommodate multiple connections and functionalities, making it versatile and adaptable.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for usage in cold temperatures without affecting performance.

Minimum Supply Voltage (Vsup): 12 V

The 12V minimum supply voltage provides sufficient power for the IC to operate effectively in different applications.

Technical Specifications

Other Function Consumer ICs MC1496D attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

MC1496D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-443-8188, 5962144438188

NIIN

144438188

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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