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MC1496P1

Onsemi

MC1496P1 by Onsemi

MC1496P1 by Onsemi is a consumer IC with 14 terminals in an inline package. It operates b/w 0-70°C, requires 12V supply voltage, and draws a max of 9mA current. Widely used in commercial applications due to its versatility and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 589 parts In-Stock

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Vyrian

USA . 305 parts In-Stock

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305

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,214 parts In-Stock

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$1.206

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$1.206

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Ampacity Inc.

Singapore . 653 parts In-Stock

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$3.800

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653

$3.800

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AZTECH Wire

Italy . 324 parts In-Stock

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$9.558

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324

$9.558

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Kulean Microsystems

USA . 4,462 parts In-Stock

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4,462

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SupplyDigital Components

Austria . 3,350 parts In-Stock

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3,350

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Problanco Electronics

Mexico . 2,898 parts In-Stock

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Continental Prestige Electronics

USA . 2,440 parts In-Stock

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Corphita

USA . 1,946 parts In-Stock

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Argo Parts USA

USA . 1,858 parts In-Stock

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UHIMA Technologies

Türkiye . 700 parts In-Stock

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700

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Corohmni

South Africa . 346 parts In-Stock

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346

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TANS Electronics

Latvia . 138 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unleash the power of advanced consumer circuit technology with the MC1496P1 by Onsemi. With a commitment to quality and innovation, Onsemi delivers cutting-edge solutions for a wide range of applications. The MC1496P1 offers unmatched value and benefits, providing customers with high performance and reliability. Elevate your projects with the MC1496P1 and experience the advantage of superior design and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 4.2 ns

Fast propagation delay ensures quick response time in logic operations.

Surface Mount: YES

Easy to install and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 1.8

Optimized voltage level for efficient performance of the logic gates.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for various environments.

Technology: CMOS

Utilizes CMOS technology known for low power consumption and high noise immunity.

Technical Specifications

Other Function Consumer ICs MC1496P1 attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

Length:

18.86 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.19 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

MC1496P1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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