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MC1496BP

Onsemi

MC1496BP by Onsemi

MC1496BP by Onsemi is a consumer IC with 14 terminals in an in-line package. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage of 12V and max current of 9mA, it is ideal for various consumer circuit designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 2,156 parts In-Stock

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Vyrian

USA . 175 parts In-Stock

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Prism Electronics

USA . 39 parts In-Stock

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LWI Electronics Inc

India . 25 parts In-Stock

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Component Stockers USA

USA . 588 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 7,400 parts In-Stock

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Kulean Microsystems

USA . 4,071 parts In-Stock

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SupplyDigital Components

Austria . 1,640 parts In-Stock

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Corphita

USA . 1,112 parts In-Stock

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Perfect Parts

USA . 912 parts In-Stock

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UHIMA Technologies

Türkiye . 902 parts In-Stock

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Corohmni

South Africa . 449 parts In-Stock

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Problanco Electronics

Mexico . 416 parts In-Stock

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Assy Fe

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Overview

Unleash the power of innovation with the MC1496BP by Onsemi. Experience unparalleled quality and reliability from a leading manufacturer in consumer ICs. This versatile product is ideal for a wide range of applications, delivering exceptional performance and precision. Elevate your projects with the MC1496BP's cutting-edge technology, providing unmatched value and benefits to meet all your needs. Choose Onsemi for a seamless integration of functionality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the IC, making it suitable for various environmental conditions.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration and placement on circuit boards.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronic applications, ensuring compatibility and performance.

Maximum Operating Temperature: 125 °C

Can operate in high temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments without any issues.

Width: 7.62 mm

Compact size allows for efficient use of space on the circuit board.

Minimum Supply Voltage (Vsup): 12 V

Can operate at low supply voltages, making it energy efficient.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliability and performance in automotive applications.

Maximum Supply Current: 9 mA

Low supply current consumption reduces power consumption and heat generation.

Technical Specifications

Other Function Consumer ICs MC1496BP attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

Length:

18.86 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

4.19 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC1496BP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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