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MC1496P1G

Onsemi

MC1496P1G by Onsemi

MC1496P1G by Onsemi is a 14-terminal IC with max supply voltage of 12V and operating temp range of 0-70°C. It has through-hole terminals, rectangular package shape, and is used in consumer circuits for various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 58,000 parts In-Stock

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58,000

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Vyrian

USA . 7,953 parts In-Stock

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7,953

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Digiode

USA . 1,383 parts In-Stock

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1,383

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,908 parts In-Stock

1+ parts

$2.866

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3,908

$2.866

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AZTECH Wire

Italy . 891 parts In-Stock

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$5.366

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891

$5.366

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Ampacity Inc.

Singapore . 967 parts In-Stock

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$14.800

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967

$14.800

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TANS Electronics

Latvia . 8,251 parts In-Stock

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8,251

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Problanco Electronics

Mexico . 4,705 parts In-Stock

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4,705

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Argo Parts USA

USA . 3,675 parts In-Stock

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3,675

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Kulean Microsystems

USA . 3,295 parts In-Stock

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3,295

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Continental Prestige Electronics

USA . 2,677 parts In-Stock

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2,677

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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SupplyDigital Components

Austria . 984 parts In-Stock

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984

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Corohmni

South Africa . 492 parts In-Stock

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492

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Corphita

USA . 248 parts In-Stock

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248

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UHIMA Technologies

Türkiye . 215 parts In-Stock

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215

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Overview

Discover the versatile MC1496P1G by Onsemi, a top-of-the-line consumer IC that offers superior quality and performance. Ideal for a wide range of applications, this product stands out for its reliability and efficiency. With Onsemi's reputable manufacturing standards and commitment to innovation, customers can trust in the value and benefits this product delivers. From enhanced functionality to seamless integration, the MC1496P1G is designed to exceed expectations and drive success in various projects. Experience the advantages firsthand and elevate your designs with this exceptional component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the IC, making it suitable for consumer applications.

Package Shape: RECTANGULAR

Standard rectangular shape for easy integration into circuit designs.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronic applications, ensuring compatibility and performance.

No. of Terminals: 14

Provides flexibility for connecting the IC to external components in the circuit.

Minimum Operating Temperature: 0 °C

Can operate efficiently in a wide range of environmental conditions, suitable for consumer devices.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures, ensuring reliability in various operating conditions.

Maximum Seated Height: 4.19 mm

Compact size allows for space-saving designs in consumer electronics.

Minimum Supply Voltage (Vsup): 12 V

Works efficiently with a low minimum supply voltage, suitable for consumer applications.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the manufacturing process, ensuring durability.

Temperature Grade: COMMERCIAL

Meets standard commercial temperature requirements for consumer electronic products.

Maximum Supply Current: 9 mA

Low supply current consumption, suitable for battery-operated consumer devices.

Terminal Pitch: 2.54 mm

Standard terminal spacing for easy PCB layout and assembly.

Technical Specifications

Other Function Consumer ICs MC1496P1G attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.19 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC1496P1G General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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