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TDA6151-5X

Infineon Technologies

TDA6151-5X by Infineon Technologies

TDA6151-5X by Infineon is a 20-terminal IC with 12V power supply, operating from 0 to 70°C. It's a bipolar technology consumer circuit in small outline package, suitable for various consumer electronic applications. The Gull Wing terminals are tin/lead finished and the IC is surface mountable.

Median Price

$2.670

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 422 parts In-Stock

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$2.670

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Vyrian

USA . 1,649 parts In-Stock

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Pride Electronics

USA . 970 parts In-Stock

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R&J Components

USA . 935 parts In-Stock

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935

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LIBRA Elektronik GmbH

Germany . 746 parts In-Stock

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746

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ACDS - Activité Composants Distribution Service

France . 700 parts In-Stock

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700

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ComSIT Distribution GmbH

Germany . 614 parts In-Stock

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614

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Digiode

USA . 591 parts In-Stock

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591

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Manoshevitz Elec. Sales

Israel . 49 parts In-Stock

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49

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Nova Conductors

Japan . 10 parts In-Stock

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10

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GES GmbH

Germany . 6 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 4,050 parts In-Stock

1+ parts

$2.762

100+ parts

$2.652

1k+ parts

$2.541

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4,050

$2.762

$2.652

$2.541

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AZTECH Wire

Italy . 795 parts In-Stock

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$15.412

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795

$15.412

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Ampacity Inc.

Singapore . 519 parts In-Stock

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$19.800

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519

$19.800

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Kepictronics

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 3,555 parts In-Stock

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Continental Prestige Electronics

USA . 2,380 parts In-Stock

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Assy Fe

Spain . 1,935 parts In-Stock

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1,935

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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Perfect Parts

USA . 676 parts In-Stock

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676

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Corphita

USA . 602 parts In-Stock

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602

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Cyclops Electronics Ltd (Excess)

UK . 302 parts In-Stock

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302

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock the potential of your consumer electronics with the TDA6151-5X by Infineon Technologies. Crafted with precision and expertise, this versatile IC offers unrivaled quality and reliability for a wide range of applications. Whether you're enhancing audio systems or optimizing power management, this product delivers exceptional value, performance, and efficiency. Trust in the expertise of Infineon Technologies and elevate your designs to new heights with the TDA6151-5X.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and resistant to damage, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly costs.

Package Shape: RECTANGULAR

Rectangular shape helps in easy placement and alignment of the IC on the circuit board, making it user-friendly for assembly.

Power Supplies (V): 12

Operating at 12V provides sufficient power for the consumer circuit to function properly, ensuring consistent performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the IC can operate within a specified temperature range, suitable for standard consumer applications.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low power consumption, enhancing the efficiency of the consumer circuit.

Technical Specifications

Other Function Consumer ICs TDA6151-5X attributes and parameters. Explore more Other Function Consumer ICs devices from Infineon Technologies

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TDA6151-5X General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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