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TDA6651TT/C3,118

NXP Semiconductors

TDA6651TT/C3,118 by NXP Semiconductors

TDA6651TT/C3,118 by NXP Semiconductors is a consumer IC designed for efficient performance in compact applications. It operates at 5V with a max supply current of 136mA and features a thin profile, 38-terminal gull-wing package. Ideal for surface mount designs, it functions effectively in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,627 parts In-Stock

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Digiode

USA . 1,372 parts In-Stock

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1,372

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Anansix

USA . 1,174 parts In-Stock

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1,174

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One Stop Electronics

USA . 1,536 parts In-Stock

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$3.800

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$3.800

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AZTECH Wire

Italy . 1,126 parts In-Stock

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$11.290

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QUARKTWIN TECHNOLOGY LTD

USA . 7,609 parts In-Stock

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7,609

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UNI Independent Distributors

Spain . 4,447 parts In-Stock

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Corphita

USA . 3,509 parts In-Stock

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Overview

Elevate your consumer electronics with the TDA6651TT/C3,118 from NXP Semiconductors, a leader in innovation and quality. This compact, surface-mount IC excels in delivering reliable performance while maximizing space efficiency in your designs. Perfect for audio applications and home entertainment systems, it ensures enhanced sound quality and seamless integration. Trust NXP’s renowned expertise to boost your products' value and elevate user experiences!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on the PCB, facilitating higher component density and improved performance.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space utilization on the PCB, which is beneficial for compact designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring that it meets the specific needs and standards of everyday electronic devices.

Power Supplies (V): 5

Operating at a standard 5V supply voltage makes it suitable for a wide range of consumer electronics and simplifies integration.

No. of Terminals: 38

With 38 terminals, this IC provides ample connectivity options for complex functionalities, enhancing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enable efficient use of space in modern electronics, supporting sleek and compact designs.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20 °C provides flexibility for use in a variety of environments, including harsh conditions.

Terminal Position: DUAL

Dual terminal position offers design flexibility, allowing for easier routing and layout in circuit board designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and reliable connections, reducing the likelihood of mechanical stress.

Maximum Supply Current: 136 mA

With a maximum supply current of 136 mA, this IC can support moderate power requirements, making it suitable for various consumer applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density designs while maintaining performance and ease of soldering.

Technical Specifications

Other Function Consumer ICs TDA6651TT/C3,118 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G38

No. of Terminals:

38

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

136 mA

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

TDA6651TT/C3,118 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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