Loading...

TDA6651TT

NXP Semiconductors

TDA6651TT by NXP Semiconductors

TDA6651TT from NXP Semiconductors is a BICMOS consumer IC designed for efficient performance in compact applications. It operates at 5V with a max supply current of 136mA and features a small outline package with 38 terminals. Ideal for surface mount designs, it ensures reliable functionality even at -20 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,383 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,383

-

-

-

-

Digiode

USA . 3,225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,225

-

-

-

-

Anansix

USA . 608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

608

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.346

100+ parts

$2.323

1k+ parts

$2.229

10k+ parts

-

1,000

$2.346

$2.323

$2.229

-

One Stop Electronics

USA . 812 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

-

10k+ parts

-

812

$14.800

-

-

-

Assy Fe

Spain . 48,523 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

48,523

-

-

-

-

UNI Independent Distributors

Spain . 8,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,172

-

-

-

-

Corphita

USA . 586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

586

-

-

-

-

Kepictronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Overview

Elevate your consumer electronics with the TDA6651TT from NXP Semiconductors, a leader in innovative IC solutions. This compact and efficient device is designed to enhance audio quality and performance, making it perfect for a variety of applications, from TVs to mobile devices. With its robust design and exceptional reliability, the TDA6651TT ensures seamless operation, empowering you to deliver cutting-edge products that set you apart in a competitive market. Experience excellence with NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material contributes to weight reduction, cost efficiency, and enhanced durability, making it suitable for consumer applications.

Surface Mount: YES

Being surface mount compatible allows for easier assembly and reduces PCB space, making the product ideal for compact circuit designs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout and design flexibility on printed circuit boards, accommodating various applications.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC is optimized for cost-effective performance in everyday electronic devices.

Power Supplies (V): 5

Operating at a 5V power supply standard ensures compatibility with a wide range of existing power systems and simplifies integration into various devices.

No. of Terminals: 38

With 38 terminals, this IC provides ample connectivity options for multiple functions, enhancing its versatility in complex applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design optimize space utilization on circuit boards, allowing for compact designs without compromising performance.

Minimum Operating Temperature: -20 °C

A minimum operating temperature of -20 °C allows this IC to function effectively in a wide range of environmental conditions, increasing its applicability.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout options, facilitating easier integration into different PCB designs.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates robust soldering capabilities, ensuring reliable connections during assembly processes.

Technology: BICMOS

The use of BICMOS technology allows for high-speed operations and low power consumption, making this IC efficient for consumer electronics.

Terminal Form: GULL WING

Gull wing terminal form provides good mechanical strength and is suitable for automatic placement in manufacturing processes.

Maximum Supply Current: 136 mA

A maximum supply current of 136 mA allows for sufficient power to drive multiple functions, ensuring reliable performance in demanding applications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this IC is suitable for high-density applications, enabling more terminals within a smaller area.

Technical Specifications

Other Function Consumer ICs TDA6651TT attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G38

No. of Terminals:

38

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

136 mA

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

TDA6651TT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20