Loading...

TDA6650ATT/C3,518

NXP Semiconductors

TDA6650ATT/C3,518 by NXP Semiconductors

TDA6650ATT/C3,518 by NXP Semiconductors is a BICMOS consumer IC designed for efficient performance in compact applications. It operates at 5V with a max supply current of 136mA and features a thin profile, 38-terminal gull-wing package. Ideal for surface mount designs, it functions effectively in various consumer electronics.

Median Price

$3.175

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

$2.840

1k+ parts

$2.540

10k+ parts

$2.390

22,500

-

$2.840

$2.540

$2.390

DigiKey

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

-

10k+ parts

-

22,500

-

$3.740

-

-

Verical

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.175

10k+ parts

$2.987

22,500

-

-

$3.175

$2.987

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,364 parts In-Stock

1+ parts

$3.002

100+ parts

-

1k+ parts

-

10k+ parts

-

1,364

$3.002

-

-

-

Vyrian

USA . 2,205 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

-

2,205

$3.160

-

-

-

DigiKey Marketplace

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,500

-

-

-

-

Anansix

USA . 1,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,246

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 674 parts In-Stock

1+ parts

$2.844

100+ parts

-

1k+ parts

-

10k+ parts

-

674

$2.844

-

-

-

Microchip USA

USA . 8,955 parts In-Stock

1+ parts

$19.760

100+ parts

-

1k+ parts

-

10k+ parts

-

8,955

$19.760

-

-

-

UNI Independent Distributors

Spain . 6,546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,546

-

-

-

-

Overview

Elevate your consumer electronics with the TDA6650ATT/C3,518 from NXP Semiconductors—a name synonymous with quality and innovation. This versatile IC is engineered for seamless integration, providing reliable performance in audio, video, and communication applications. Its compact design and robust technology ensure efficiency and reliability, empowering your products to stand out in a competitive market. Experience unmatched value and superior advantages with NXP’s trusted expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making this product ideal for a variety of consumer applications.

Surface Mount: YES

Surface mount technology allows for compact design and ease of automated assembly, contributing to efficient manufacturing processes and space-saving on printed circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape is versatile and commonly used in consumer electronics, facilitating compatibility with different circuit board layouts.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC is optimized for high performance and reliability, meeting the demands of everyday electronic devices.

Power Supplies (V): 5

Operating at a standard 5V supply makes this IC compatible with a wide range of consumer products, enhancing versatility and ease of integration.

No. of Terminals: 38

With 38 terminals, this IC offers ample connectivity options, allowing for complex functionalities in a compact form factor that is essential for modern electronics.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design enable high-density layouts, making it suitable for space-constrained applications like portable devices.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20 °C broadens the range of environments where this IC can function, ensuring reliability in various climatic conditions.

Terminal Position: DUAL

The dual terminal position simplifies the design process, allowing for more straightforward layout and integration on circuit boards.

Technology: BICMOS

The BICMOS technology combines the benefits of bipolar and CMOS technologies, offering high-speed operation and low power consumption for efficient performance.

Maximum Supply Current: 136 mA

A maximum supply current of 136 mA ensures that this IC can handle a significant load, making it suitable for demanding applications while maintaining power efficiency.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density packaging, facilitating the design of smaller and more efficient electronic systems.

Technical Specifications

Other Function Consumer ICs TDA6650ATT/C3,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G38

No. of Terminals:

38

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

136 mA

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

TDA6650ATT/C3,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20