Loading...

TDA6650TT

NXP Semiconductors

TDA6650TT by NXP Semiconductors

TDA6650TT by NXP Semiconductors is a BICMOS consumer IC designed for efficient performance in compact applications. It operates at 5V with a max supply current of 136mA and features a thin profile, making it ideal for space-constrained devices. Its dual terminal design ensures reliable connectivity in various electronic products.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,281 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,281

-

-

-

-

Vyrian

USA . 906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

906

-

-

-

-

Digiode

USA . 412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

412

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 672 parts In-Stock

1+ parts

$17.800

100+ parts

-

1k+ parts

-

10k+ parts

-

672

$17.800

-

-

-

UNI Independent Distributors

Spain . 2,904 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,904

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Kepictronics

USA . 192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

192

-

-

-

-

Corphita

USA . 59 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

59

-

-

-

-

Overview

Unlock exceptional performance with the TDA6650TT from NXP Semiconductors, a leader in innovative technology. This versatile consumer IC offers unmatched reliability and efficiency, making it perfect for a range of applications, from audio systems to consumer electronics. With its compact design and energy-saving features, you’ll enjoy enhanced functionality without compromising on quality. Elevate your products with the trusted expertise of NXP and experience the benefits of superior engineering today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Being surface mount allows for easier assembly on PCBs, enabling higher density designs and improved performance in compact devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards and provides efficient layout options for designers.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliable performance in devices used by end consumers.

Power Supplies (V): 5

Operating on a standard 5V supply makes it compatible with a wide range of systems and simplifying integration.

No. of Terminals: 38

A higher number of terminals allows for more complex functionality and interfacing options, catering to advanced applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch design enhance space efficiency, making it ideal for modern, compact electronic devices.

Minimum Operating Temperature: -20 °C

With a minimum operating temperature of -20 °C, this IC can function in diverse environmental conditions, enhancing versatility.

Terminal Position: DUAL

Dual terminal position provides flexible mounting options and enhances design adaptability in circuit layouts.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with modern reflow soldering processes, promoting reliable assembly.

Technology: BICMOS

Utilizing BICMOS technology combines the benefits of both bipolar and CMOS, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering properties and mechanical stability, ensuring reliable connections on PCBs.

Maximum Supply Current: 136 mA

A maximum supply current of 136 mA allows for adequate power delivery for various functions, supporting demanding applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is ideal for dense PCB designs, enabling smaller footprints without sacrificing performance.

Technical Specifications

Other Function Consumer ICs TDA6650TT attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G38

No. of Terminals:

38

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

136 mA

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

TDA6650TT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20