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TDA6651ATT

NXP Semiconductors

TDA6651ATT by NXP Semiconductors

TDA6651ATT by NXP Semiconductors is a BICMOS consumer IC designed for efficient performance in compact applications. It operates at 5V with a max supply current of 136mA and features a thin profile, 38-terminal package. Ideal for surface mount designs, it ensures reliable functionality from -20 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 782 parts In-Stock

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Anansix

USA . 726 parts In-Stock

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Digiode

USA . 226 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,299 parts In-Stock

1+ parts

$20.800

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1,299

$20.800

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UNI Independent Distributors

Spain . 4,283 parts In-Stock

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Corphita

USA . 3,517 parts In-Stock

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3,517

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Overview

Elevate your consumer electronics with the TDA6651ATT from NXP Semiconductors, a leader in innovative technology. This high-quality IC combines reliability and efficiency, seamlessly enhancing audio and video applications. With its compact, thin-profile design, it fits perfectly into modern devices, providing exceptional performance even under challenging conditions. Count on NXP for cutting-edge solutions that deliver outstanding value and elevate user experiences!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for consumer applications.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern electronic devices, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCB layouts, enabling higher density designs beneficial for consumer electronics.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer applications, this IC is tailored to meet the needs of various electronic devices, ensuring effectiveness and reliability.

Power Supplies (V): 5

Operating at a standard 5V supply makes this IC compatible with a wide range of consumer devices, simplifying design requirements.

No. of Terminals: 38

With 38 terminals, this IC can handle a variety of functions simultaneously, providing flexibility in design and thereby enriching product capabilities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile suit compact devices, which is essential for portable consumer electronics, ensuring minimal space consumption.

Minimum Operating Temperature: -20 °C

The capability to operate at -20 °C allows the IC to function in colder environments, broadening its application range.

Terminal Finish: Tin/Lead (Sn/Pb)

The Tin/Lead finish provides excellent solderability and reliability in connections, ensuring robust performance over the product's lifespan.

Terminal Position: DUAL

Dual terminal positioning enhances the ease of layout design and optimization on PCBs, facilitating efficient use in diverse applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, ensuring high performance, low power consumption, and enhanced functionality.

Maximum Supply Current: 136 mA

A maximum supply current of 136 mA indicates a strong capability for handling demanding loads, suitable for sophisticated consumer devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density connections that support compact designs, ideal for modern electronic applications.

Technical Specifications

Other Function Consumer ICs TDA6651ATT attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e0

No. of Terminals:

38

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

136 mA

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

TDA6651ATT General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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